Industrial Wireless Solutions
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- In stock
5G NR FR1 module, M.2 3052 Key B, USB only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...
- In stock
4G LTE Cat4. + GNSS module with mPCIe form factor, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module, with GPS, for EU, for TW, for...
- In stock
802.11ax+BT5.3, NXP 88W9098, PCIe-UART, M.2 2830 NXP 88W9098. 2Tx/2Rx. IEEE 802.11 a/b/g/n/ac/ax (2.4GHz/5GHz) + BT 5.3. Form factor: M.2 2830 E key. Wi-Fi: PCIe; Bluetooth: UART. OS: Linux. Operating Temp: -40 ~ 85 °C (-40 ~ 185 °F). 28 x 30 x 3.95 mm (1.10 x 1.18 x 0.15 in). IC: NXP 88W9098.
- In stock
5G NR FR1 module, USB communication interface, with GNSS, for US Main Chipset Qualcomm SDX62. Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). AIW-356 DQ-N01: 5G NR FR1...
- In stock
GNSS module with half size mini-PCIe form factor, featuring dead reckoning function Half size mini-PCIe form factor. Standard Precision GNSS L1 band. 92 Channels u-blox NEO-M9 engine (GPS, GLONASS, BeiDou, Galileo, QZSS and SBAS). USB 2.0 communication interface. Support Dead Reckoning (DR), Including IMU and Oscillator. 2 second TTFF for Hot Starts,...
- In stock
5G NR FR1 module, USB communication interface, with GNSS, for Japan, for South Korea Main Chipset Qualcomm SDX62. Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). AIW-356...
- In stock
4G LTE Cat4. + GNSS modem card, with M.2 3052 form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...
- In stock
4G LTE Cat4. + GNSS modem card, with mini-PCIe form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...
- In stock
4G LTE Cat4. + GNSS module with mPCIe form factor, with Sim slot, EU version Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE CAT4 , WCDMA/GSM/GPRS/EDGE. LTE: 150Mbps DL/50Mbps UL (Cat 4). Operating temperature: Normal: : -20°C ~ +55°C/Extended: -40°C ~ +85°C. With GPS. With SIM slot.
- In stock
4G LTE Cat4. + GNSS module with mPCIe form factor, for EU, for TW, for Australia, for Brazil Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module,...
- In stock
GNSS module with M.2 2242 B-key form factor M.2 2242 Key B form factor. 92 channel support u-blox NEO-M9N engine (GPS, GLONASS, BeiDou, Galileo, QZSS andSBAS). Open sky cold start 24 second / Aided starts 2 second. USB 2.0 communication interface. Accuracy 1.5m CEP. Operating temperature: -40°C ~ +85°C / -40°F ~ 185°F.
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5G NR FR1 module, M.2 3052 Key B, PCIe only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...
- On enquiry
- Na dotaz
5G NR FR1 module, USB communication interface, with GNSS, for EU, for Australia Main Chipset Qualcomm SDX62. Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). AIW-356...
- On enquiry
- Na dotaz
LGA solder down type,GNSS module,U-blox Stamp type form factor. 92 channel support u-blox NEO-M9N engine (GPS, GLONASS, BeiDou, Galileo, QZSS andSBAS). Open sky cold start 24 second / Aided starts 2 second. Accuracy 2m CEP. Operating temperature: -40°C ~ +85°C / -40°F ~ 185°F.
- On enquiry
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M.2 3042 Key-B LTE CAT16 module "module+cable+antenna" wireless kit level certification ready for FCC/IC/CE-RED. 4G LTE FDD&TDD :1Gbps DL(Cat.16). standard M.2 3042 key-B form factor with PCI-e bus. Operation Temperature : -20 ~ +65 °C. Cable*4 with accessories for IPC system assembly between module and antenna. Standard dipole antenna*4 for IPC systems...
- On enquiry
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FCC/CE-RED Wireless kit(module+cable+antenna) level certification M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna. IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC certification....
- On enquiry
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FCC/CE-RED Wireless kit(module+cable+antenna) level certification M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna. IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC certification....
- On enquiry
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Intel 9260.NGWGII (-40~ 85 degree) wireless kit (module+cable+antenna) M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna. IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC...
- On enquiry
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5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
- On enquiry
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5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
- On enquiry
- Na dotaz
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
- On enquiry
- Na dotaz
WISE-3610 Private LoRa Network IoT Gate Qualcomm Atheros Quard-Core ARM Cortex-A7 SoC. Built-in Dual Band Concurrent Wi-Fi MU-MIMO (2x2). LPWAN LoRa Private (WISE-Link) Connectivity. WAN x1 / LAN x1 Gigabit Ethernet. Integration of Modbus TCP and Modbus RTU networks. Rich Network Scanrio by S/W Configuration. OpenWRT BSP embeded. Web UI user interface....
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