Industrial Wireless Solutions

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FCC/CE-RED Wireless kit(module+cable+antenna) level certification M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna . IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC certification ....

5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .

GNSS module with M.2 2242 B-key form factor M.2 2242 Key B form factor. 92 channel support u-blox NEO-M9N engine (GPS, GLONASS, BeiDou, Galileo, QZSS andSBAS). Open sky cold start 24 second / Aided starts 2 second. USB 2.0 communication interface. Accuracy 2m CEP. Operating temperature: -40°C ~ +85°C / -40°F ~ 185°F.

5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .

FCC/CE-RED Wireless kit(module+cable+antenna) level certification M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna . IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC certification ....

4G LTE Cat4. + GNSS module with mPCIe form factor, with Sim slot, EU version Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE CAT4 , WCDMA/GSM/GPRS/EDGE. LTE: 150Mbps DL/50Mbps UL (Cat 4). Operating temperature: Normal: : -20°C ~ +55°C/Extended: -40°C ~ +85°C. With GPS. With SIM slot.

4G LTE Cat4 modem (US) with M.2 3052 form factor Pre-carrier-certified 4G LTE Cat4. modem. Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 2 types adapter boards/USB 2.0 bus: PCI Express mini-card and M.2 3052. Data throughput :4G/LTE Cat. 4 (FDD-LTE: 150 Mbps DL, 50 Mbps UL; TDD-LTE: 130 Mbps DL, 30 Mbps UL)....

4G LTE Cat4 modem (US) with mPCIe form factor Pre-carrier-certified 4G LTE Cat4. modem. Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 2 types adapter boards/USB 2.0 bus: PCI Express mini-card and M.2 3052. Data throughput :4G/LTE Cat. 4 (FDD-LTE: 150 Mbps DL, 50 Mbps UL; TDD-LTE: 130 Mbps DL, 30 Mbps UL)....

M.2 3042 Key-B LTE CAT16 module "module+cable+antenna" wireless kit level certification ready for FCC/IC/CE-RED. 4G LTE FDD&TDD :1Gbps DL(Cat.16). standard M.2 3042 key-B form factor with PCI-e bus. Operation Temperature : -20 ~ +65 °C. Cable*4 with accessories for IPC system assembly between module and antenna. Standard dipole antenna*4 for IPC systems...

Intel 9260.NGWGII (-40~ 85 degree) wireless kit (module+cable+antenna) M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna . IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC...

5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .

WISE-3610 Private LoRa Network IoT Gate Qualcomm Atheros Quard-Core ARM Cortex-A7 SoC. Built-in Dual Band Concurrent Wi-Fi MU-MIMO (2x2). LPWAN LoRa Private (WISE-Link) Connectivity. WAN x1 / LAN x1 Gigabit Ethernet. Integration of Modbus TCP and Modbus RTU networks. Rich Network Scanrio by S/W Configuration. OpenWRT BSP embeded. Web UI user interface....

AIW-3 series LTE CAT4 mini PCIe module f Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. PCI Express mini-card/USB 2.0. Data throughput :4G/LTE Cat. 4 (FDD-LTE: 150 Mbps DL, 50 Mbps UL; TDD-LTE: 130 Mbps DL, 30 Mbps UL). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C.
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