Industrial Wireless Solutions

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4G LTE Cat4. + GNSS module with mPCIe form factor, for EU, for TW, for Australia, for Brazil Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module,...

5G NR FR1 module, M.2 3052 Key B, USB only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...

4G LTE Cat4. + GNSS module with mPCIe form factor, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module, with GPS, for EU, for TW, for...

GNSS module with M.2 2242 B-key form factor M.2 2242 Key B form factor. 92 channel support u-blox NEO-M9N engine (GPS, GLONASS, BeiDou, Galileo, QZSS andSBAS). Open sky cold start 24 second / Aided starts 2 second. USB 2.0 communication interface. Accuracy 1.5m CEP. Operating temperature: -40°C ~ +85°C / -40°F ~ 185°F.

5G NR FR1 module, USB communication interface, with GNSS, for EU, for Australia Main Chipset Qualcomm SDX62. Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). AIW-356...

FCC/CE-RED Wireless kit(module+cable+antenna) level certification M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna. IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC certification....

4G LTE Cat4. + GNSS modem card, with mini-PCIe form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...

5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .

4G LTE Cat4. + GNSS module with mPCIe form factor, with Sim slot, EU version Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE CAT4 , WCDMA/GSM/GPRS/EDGE. LTE: 150Mbps DL/50Mbps UL (Cat 4). Operating temperature: Normal: : -20°C ~ +55°C/Extended: -40°C ~ +85°C. With GPS. With SIM slot.

5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .

5G NR FR1 module, M.2 3052 Key B, PCIe only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...
- On enquiry

4G LTE Cat4. + GNSS modem card, with M.2 3052 form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...
- On enquiry

M.2 3042 Key-B LTE CAT16 module "module+cable+antenna" wireless kit level certification ready for FCC/IC/CE-RED. 4G LTE FDD&TDD :1Gbps DL(Cat.16). standard M.2 3042 key-B form factor with PCI-e bus. Operation Temperature : -20 ~ +65 °C. Cable*4 with accessories for IPC system assembly between module and antenna. Standard dipole antenna*4 for IPC systems...
- On enquiry

FCC/CE-RED Wireless kit(module+cable+antenna) level certification M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna. IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC certification....
- On enquiry

Intel 9260.NGWGII (-40~ 85 degree) wireless kit (module+cable+antenna) M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna. IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC...
- On enquiry

5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
- On enquiry

WISE-3610 Private LoRa Network IoT Gate Qualcomm Atheros Quard-Core ARM Cortex-A7 SoC. Built-in Dual Band Concurrent Wi-Fi MU-MIMO (2x2). LPWAN LoRa Private (WISE-Link) Connectivity. WAN x1 / LAN x1 Gigabit Ethernet. Integration of Modbus TCP and Modbus RTU networks. Rich Network Scanrio by S/W Configuration. OpenWRT BSP embeded. Web UI user interface....
- On enquiry