Qualcomm Wi-Fi 6E M.2 2230 E key Industrial-grade temperature range (-40~85°C). Compatible with Nvidia and NXP platforms. Additional 6GHz support. DBDC(Dual band dual concurrent) support. Multiple certificates (FCC/CE/IC/TELEC/KC/NCC).
4G LTE Cat4. + GNSS module with mPCIe form factor, for EU, for TW, for Australia, for Brazil Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module,...
5G NR FR1 module, M.2 3052 Key B, USB only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...
4G LTE Cat4. + GNSS module with mPCIe form factor, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module, with GPS, for EU, for TW, for...
802.11ax+BT5.3, NXP 88W9098, PCIe-UART, M.2 2830 NXP 88W9098. 2Tx/2Rx. IEEE 802.11 a/b/g/n/ac/ax (2.4GHz/5GHz) + BT 5.3. Form factor: M.2 2830 E key. Wi-Fi: PCIe; Bluetooth: UART. OS: Linux. Operating Temp: -40 ~ 85 °C (-40 ~ 185 °F). 28 x 30 x 3.95 mm (1.10 x 1.18 x 0.15 in). IC: NXP 88W9098.
Industrial grade Wi-Fi 6 M.2 solution IEEE 802.11 ax/ac/b/g/n + Bluetooth 5.0 HS standard. Perfect fit for Rockchip platform. Industrial-grade temperature range (-40~85°C). FCC/CE/IC/TELEC certified.
GNSS module with M.2 2242 B-key form factor M.2 2242 Key B form factor. 92 channel support u-blox NEO-M9N engine (GPS, GLONASS, BeiDou, Galileo, QZSS andSBAS). Open sky cold start 24 second / Aided starts 2 second. USB 2.0 communication interface. Accuracy 1.5m CEP. Operating temperature: -40°C ~ +85°C / -40°F ~ 185°F.
5G NR FR1 module, USB communication interface, with GNSS, for EU, for Australia Main Chipset Qualcomm SDX62. Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). AIW-356...
802.11ax+BT5.2, Realtek 8852BE, PCIe-USB, M.2 IEEE 802.11ax (2.4GHz+5GHz) + BT5.2. 2Tx / 2Rx. RTL8852BE. 22mm x 30mm x 2.2mm. M.2 2230 A-E Key. 0~70 degree. Wi-Fi: PCIe, BT: USB.
FCC/CE-RED Wireless kit(module+cable+antenna) level certification M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna. IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC certification....
802.11ac+BT5.0 NXP 88W8997 M.2 2230 PCIe-UART IEEE 802.11ac + BT 5.0. 2 TX / 2RX. Wide operating temperature -30 ~ 85 °C (- 22 ~ 185 °F). Supports Linux OS. M.2 2230 form factor module (L x W x H) 30 x 22 x 2.85 mm/ 1.18 x .86 x .11 in. Wi-Fi: PCIe / BT: UART.
4G LTE Cat4. + GNSS modem card, with mini-PCIe form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
AX210 6E 802.11ax+BT5.2 module+antenna+cable IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3. 2Tx/ 2Rx. WPA2*, WPA3*. Windows 10*, Linux*, Chrome OS*. WIFI: PCI-E, Bluetooth: USB. M.2 2230 A-E Key form factor.
4G LTE Cat4. + GNSS module with mPCIe form factor, with Sim slot, EU version Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE CAT4 , WCDMA/GSM/GPRS/EDGE. LTE: 150Mbps DL/50Mbps UL (Cat 4). Operating temperature: Normal: : -20°C ~ +55°C/Extended: -40°C ~ +85°C. With GPS. With SIM slot.
Qualcomm Wi-Fi6E industrial grade solution Industrial-grade temperature range (-40~85°C). Compatible with Nvidia and NXP platforms. Additional 6GHz support. DBDC(Dual band dual concurrent) support.
Wi-Fi 6E+BT5.3,M.2 2230,PCIe-USB IEEE 802.11ax (2.4GHz/5GHz/6GHz) + BT5.3. MTK 7922. 2 Tx / 2 Rx. M.2 2230 E Key. Interface : PCIe - USB. Operating Temperature: -10 ~ 70 °C.
802.11ax+BT5.3 NXP 88W9098 LGA type NXP 88W9098. IEEE 802.11 a/b/g/n/ac/ax (2.4GHz/5GHz) + BT 5.3. Wi-Fi: PCIe/SDIO ; Bluetooth: UART. OS: Linux. Operating Temp: -40 ~ 85 °C (-40 ~ 185 °F). form factor: LGA type.
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
5G NR FR1 module, M.2 3052 Key B, PCIe only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...
GNSS module with half size mini-PCIe form factor Half size mini-PCIe form factor. 92 channel support u-blox NEO-M9N engine (GPS, GLONASS, BeiDou, Galileo, QZSS andSBAS). USB 2.0 communication interface. Accuracy 2m CEP. Operating temperature: -40°C ~ +85°C / -40°F ~ 185°F.
LGA solder down type,GNSS module,U-blox Stamp type form factor. 92 channel support u-blox NEO-M9N engine (GPS, GLONASS, BeiDou, Galileo, QZSS andSBAS). Open sky cold start 24 second / Aided starts 2 second. Accuracy 2m CEP. Operating temperature: -40°C ~ +85°C / -40°F ~ 185°F.
6E AX210 (Vpro) -40~85 degree wireless kit IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3. 2Tx/ 2Rx. WPA2*, WPA3*. Windows 10*, Linux*, Chrome OS*. WIFI: PCI-E, Bluetooth: USB. M.2 2230 A-E Key form factor.
6E AX210 (no.vpro), -40~85degree wireless kit IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3. 2Tx/ 2Rx. WPA2*, WPA3*. Windows 10*, Linux*, Chrome OS*. WIFI: PCI-E, Bluetooth: USB. M.2 2230 A-E Key form factor.
CIRCUIT BOARD, WISE-1840 MINI PCIE Card for Zigbee host control Standard Full-Mini Card Form Factor. Support up to 400 EPD-023, EPD-053 devices. Proprietary Network Protocol base on IEEE802.15.4.
AX210 6E 802.11ax+BT5.2 vpo module+antenna+cable IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3. 2Tx/ 2Rx. WPA2*, WPA3*. Windows 10*, Linux*, Chrome OS*. WIFI: PCI-E, Bluetooth: USB. M.2 2230 A-E Key form factor.
WISE-1510 M2.COM LoRa module-NA915 ARM Cortex-M4 Core Processor. Built-in LoRa / LoRaWAN connectivity. Great for Low Power Wide Range application. Rich interfaces for sensor and I/O control. Support wide temperature -40 ~ 85 °C.
WISE-1510 M2.COM LoRa module-EU868 ARM Cortex-M4 Core Processor. Built-in LoRa / LoRaWAN connectivity. Great for Low Power Wide Range application. Rich interfaces for sensor and I/O control. Support wide temperature -40 ~ 85 °C.
4G LTE Cat4. + GNSS modem card, with M.2 3052 form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...
M.2 3042 Key-B LTE CAT16 module "module+cable+antenna" wireless kit level certification ready for FCC/IC/CE-RED. 4G LTE FDD&TDD :1Gbps DL(Cat.16). standard M.2 3042 key-B form factor with PCI-e bus. Operation Temperature : -20 ~ +65 °C. Cable*4 with accessories for IPC system assembly between module and antenna. Standard dipole antenna*4 for IPC systems...
FCC/CE-RED Wireless kit(module+cable+antenna) level certification M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna. IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC certification....
Intel 9260.NGWGII (-40~ 85 degree) wireless kit (module+cable+antenna) M.2 2230 module card. Intel Wireless AC9260. 2Tx/ 2Rx two antenna. IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard. EWM-W192K1/K2 operating temperature: 0 ~ 70 °C. EWM-W192K5 operating temperature: -40 ~ 85 °C. 3.3V ±0.165V. Wireless kit(module+cable+antenna) has CE/FCC...
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
CIRCUIT BOARD, 13.3 " ePaper display module & display 13.3" e-Paper panel display. Support temperature 0 ~ 50 °C for Black and White, 0 ~ 40 °C for Red, Black and White. Micro USB and SPI connector to host computer to control ePaper.
CIRCUIT BOARD, 13.3 " B/W Wireless EPD solution in 2.4G ARM Cortex-M4 Core Processor. Support IEEE 802.11b/g/n . 13.3" e-Paper panel display. Support temperature 0 ~ 50 °C for Black/White , 0 ~ 40 °C for Red/Black/White. Support over-the-air upgrade (OTA).
CIRCUIT BOARD, 13.3 Wireless ePaper display solution in 2.4G ARM Cortex-M4 Core Processor. Support IEEE 802.11b/g/n . 13.3" e-Paper panel display. Support temperature 0 ~ 50 °C for Black/White , 0 ~ 40 °C for Red/Black/White. Support over-the-air upgrade (OTA).
ROUTER AND SWITCH, WISE-3610 EPD IoT Gateway for EU Qualcomm Atheros Quard-Core ARM Cortex-A7 SoC. Built-in Dual Band Concurrent Wi-Fi MU-MIMO (2x2). WAN x1 / LAN x1 Gigabit Ethernet. OpenWRT BSP embedded. Web UI user interface.
WISE-3610Z for EPD Network IoT Gateway Qualcomm Atheros Quard-Core ARM Cortex-A7 SoC. WAN x1 / LAN x1 Gigabit Ethernet. OpenWRT BSP embedded. Web UI user interface.
WISE-3610 Private LoRa Network IoT Gate Qualcomm Atheros Quard-Core ARM Cortex-A7 SoC. Built-in Dual Band Concurrent Wi-Fi MU-MIMO (2x2). LPWAN LoRa Private (WISE-Link) Connectivity. WAN x1 / LAN x1 Gigabit Ethernet. Integration of Modbus TCP and Modbus RTU networks. Rich Network Scanrio by S/W Configuration. OpenWRT BSP embeded. Web UI user interface....
