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Technical Documentation:
insert_drive_file AIW-343_DS(051022)20220510145826.pdf
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5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
4G LTE Cat4. + GNSS modem card, with M.2 3052 form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
4G LTE Cat4. + GNSS modem card, with M.2 3052 form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...
