UDIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
UDIMM DDR5 5600 32GB 2Gx8 Hynix Data Transfer Rate: 5600 MT/s. Capacity : 8/16/24/32/48 GB. Original Samsung/Hynix/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
UDIMM DDR5 5600 8GB 1Gx16 Hynix Data Transfer Rate: 5600 MT/s. Capacity : 8/16/24/32/48 GB. Original Samsung/Hynix/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
UDIMM DDR5 5600 16GB 2Gx8 Hynix Data Transfer Rate: 5600 MT/s. Capacity : 8/16/24/32/48 GB. Original Samsung/Hynix/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
UDIMM DDR5 4800 32GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
UDIMM DDR5 4800 8GB 1Gx16 (0-85) Micron Data Transfer Rate: 4800 MT/s. Capacity : 16GB/32GB. Original Micron/Samsung IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 85°C.
UDIMM DDR5 4800 32GB 2Gx8 (0-85) Micron Data Transfer Rate: 4800 MT/s. Capacity : 16GB/32GB. Original Micron/Samsung IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 85°C.
UDIMM DDR5 4800 16GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
UDIMM DDR5 4800 16GB 2Gx8 (0-85) Micron Data Transfer Rate: 4800 MT/s. Capacity : 16GB/32GB. Original Micron/Samsung IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 85°C.