16GB DDR4 DIMM-3200 1GbX8 SAM 16GB. Speed 3200MHz. 30u" Gold Plating Thickness. Anti-sulfurization resistance. Unbuffered.
32G DDR4-3200 2GX8 1.2V SAM-20~85℃ SAM Original Chip. Industrial Design for Improved Reliability. PCB: 30μ gold finger. Anti-sulfuration. SEMI Wide-temp Support -20~85℃.
16GB DDR5-5600 2GX8 1.1V SAM -20~85℃ SAM Original Chip. Industrial Design for Improved Reliability. PCB: 30μ gold finger. Anti-sulfuration. Semi Wide-temp Support -20~85℃.
16GB DDR4 SODIMM-3200 1GbX8 SAM 16GB. Speed 3200MHz. 30u" Gold Plating Thickness. Anti-sulfurization resistance. Unbuffered.
Advantech 8G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip DDR3-1600 SO-DIMM. 204-Pin. 512MX8. Samsung Chip.
Advantech 16G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip Samsung Original Chip. Increased Banks and Burst Length. DDR5 4.8GT/s. Same-Bank Refresh. On-die ECC for Enhanced RAS.
32GB DDR4 DIMM-3200 2GbX8 SAM 32GB. Speed 3200MHz. 30u" Gold Plating Thickness. Anti-sulfurization resistance. Unbuffered.
CORE I9 2.3G 30M 16C 1700P I9-12900E Intel Core i9-12900. 2.4 GHz. 30 MB Cache. FCLGA1700.
80+ Bronze PS/2 SPS 300W ATX (DELTA) RoHS Full range AC input 100-240V. Low ripple & noise. Support OVP, SCP and OCP circuit protection. Common safety for CB / CE / CUL / FCC / BSMI / KC / CCC. 80 Plus Bronze Available.
CORE 3.2G 12M 1151P 6CORE I7-8700 Intel Core i7-8700. 3.2 GHz. 12 MB Cache. FCLGA1151.
16G DDR4-3200 1GX8 1.2V SAM -20~85℃ SAM Original Chip. Industrial Design for Improved Reliability. PCB: 30μ gold finger. Anti-sulfuration. SEMI Wide-temp Support -20~85℃.
Windows 11 Pro 64-bit EN DVD INTL. For 1 device installation. It supports 64-bit only. Instantly productive and secure design for hybrid work. Optimize screen space and workflow.
80+ GOLD FLEX SPS 500W ATX(FSP) RoHS Full range AC input 100-240V. Low ripple & noise. Supports OVP, SCP and OPP circuit protection. Common safety for CE, FCC, UL, CB, TUV, CCC, KC. 80 Plus Gold Available.
Advantech 32GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip Hynix Original Chip. Increased Banks and Burst Length. DDR5 5.6GT/s. Same-Bank Refresh. On-die ECC for Enhanced RAS.
CORE I7 2.9G 16M 1200P 8C I7-10700E Core i7-10700E. 2.9 GHz. 16 MB Cache. FCLGA1200.
CORE I5 3.1G 12M 1200P 6C I5-10500E Intel Core i5-10500E. 3.1 GHz. 12 MB Cache. FCLGA1200.
Advantech 8G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip DDR3 1600Mhz Unbuffered DIMM. 30μ" gold plating thickness. 1.35V power consumption. Samsung original chip.
CORE I7 2.1G 25M 12C 1700P I7-12700 Intel Core i7-12700. 1.0 GHz. 25 MB Cache. FCLGA1700.
32G SO-DDR4-3200 2GX8 1.2V SAM -20~85℃ SAM Original Chip. Industrial Design for Improved Reliability. PCB: 30μ gold finger. Anti-sulfuration. Semi Wide-temp Support -20~85℃.
SG 2.5" 1TB 5KRPM 7MM SATAIII 128MB 1 TB Storage. 5K RPM 128MB Cache. Ideal for General Storage Purpose. SATA Interface. 3 year limited warranty.
CORE I7 1.9G 24M 16C 1700P I7-13700E Intel Core i7-13700E. 1.9GHz. 24MB Cache. FCLGA1700.
80+ Bronze FLEX SPS 250W ATX(DELTA) RoHS Full range AC input 100-240V. Low ripple & noise. Supports OVP, OTP, SCP and OCP circuit protection. Common safety for CE, FCC, UL, CB, TUV, CCC, KC, BSMI. 80 Plus Bronze Available.
80+ Bronze PS/2 SPS 500W ATX (FSP) RoHS Full range AC input 100-240V. Low ripple & noise. Supports OVP, SCP and OCP circuit protection. Common safety for CE, FCC, UL, CB, TUV, CCC, KC. 80 Plus Bronze Available.
CORE I5 2.4G 9.5M 10C 1700P I5-13400E Intel Core i5-13400E. 2.4GHz. 9.5MB Cache. FCLGA1700.
CORE I7 2.1G 24M 16C 1700P I7-13700 Intel Core i7-13700. 2.1GHz. 24MB Cache. FCLGA1700.
INTEL NIC 10/100/1000M PCIEx4 2pt. RJ45 10/100/1000Mbps. Dual Ports. PCIe v2.1 (5.0GT/s).
80+ GOLD FLEX SPS 350W ATX(FSP) RoHS Full range AC input 100-240V. Low ripple & noise. Supports OVP, SCP and OPP circuit protection. Common safety for CE, FCC, UL, CB, TUV, CCC, KC. 80 Plus Gold Available.
INTEL NIC 10/100/1000M PCIex1 1pt RJ45 Supports 10/100/1000 Mbps per port. IEEE 802.1Qav Audio-Video-Bridging (AVB) for tightly controlled media stream synchronization, buffering, and reservation. Standard CAT5 cabling with RJ45 connectors. PCIe 2.1 (2.5 GT/s) Bus Type.
32GB DDR5-5600 2GX8 1.1V SAM SAM Original Chip. PCB: 30μ gold finger. Anti-sulfuration. On-die ECC for Enhanced RAS. Operating Temperature: 0°C ~ 85°C.
32GB R-DDR5 4800 R-Dimm 2GX8 1.1V SAM Samsung Original Chip. Increased Banks and Burst Length. DDR5 4.8GT/s. Same-Bank Refresh. On-die ECC for Enhanced RAS.
CORE 3.6G 6M 1151P 4CORE I3-8100 Intel Core i3-8100. 3.6 GHz. 6 MB Cache. FCLGA1151.
CORE I9 2.8G 20M 1200P 10C I9-10900E Intel Core i9-10900E. 2.8 GHz. 20 MB Cache. FCLGA1200.
Adaptec 3101E-4i 4 Ports 12Gb/s PCIEX8 (TEST) RAID 0, 1, 10. Support 4 Ports (4 internal). 12Gbps compatibility with SAS/SATA HDD or SSD devices. Mixed mode RAID adapter and caching HBA functionality.
CORE 2.6G 12M 1151P 8C I7-9700E Intel Core i7-9700E. 2.6 GHz. 12 MB Cache. FCLGA1151.
ADAPTEC 3102-8i 8pt 12Gb/s SAS PCIEx8 RAID 0, 1, 5, 6, 10, 50, 60, 1 ADM and 10 ADM. Supports 8 Ports. 12 Gbps compatibility with SAS/SATA HDD or SSD devices. Accelerates storage with up to 4 GB of high-speed DRAM cache. maxCache 4.0 included on all adapters with up to ~2TB SSD cache.
TR 128GB 2.5" SSD SATAIII MLC SATA 6Gbps. 2D MLC NAND Flash. DDR3 DRAM cache. Global wear-leveling function. Supports S.M.A.R.T. function.
Advantech 8G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip DDR3 1600Mhz Unbuffered SO-DIMM. 30μ" gold plating thickness. 1.35V power consumption. Samsung original chip.
INTEL NIC 10/100/1000M PCIEx4 4pt. RJ45 10/100/1000Mbps. 4 Ports. PCIe v2.1 (5.0GT/s).
CREMAX M-RACK 5.25" 2X2.5" SAS/ST BLK(G) Fits 2 x 2.5" SAS & SATA SSD/HDD & a slim ODD in a 5.25" device bay. Heavy duty full metal construction. Front LED indicator lights.
Advantech 32GB SO-DIMM DDR5-4800 262Pin 2Gx8 1.1V Unbuffered Samsung Chip Samsung Original Chip. Dual 32-bit Subchannels. Increased Banks and Burst Length. DDR5 4.8GT/s. Same-Bank Refresh. On-die ECC for Enhanced RAS.
CREMAX M-RACK 3.25" 1X2.5" SAS/SATA BLACK(G) Fits 1 x 2.5" SATA & SAS HDD/SSD in a 3.5" device bay. Heavy duty full metal construction. Safeguard key lock function. Support up to SATA 6Gb/s and hot swap.
CORE 3G 9M 1151P 6CORE I5-8500 Intel Core i5-8500. 3.0 GHz. 9 MB Cache. FCLGA1151.
CORE 2.2G 9M 1151P 6C I5-9500TE Intel Core i5-9500TE. 2.2 GHz. 9 MB Cache. FCLGA1151.
CORE 3.6G 8M 1151P 4CORE I7-7700 Intel 7th Generation Core i7-7700. 3.6 GHz. 8 MB Cache. LGA1151.
MiniRPS 300W ATX WITH ACTIVE PFC(ZIPPY) RoHS Full range AC input 100-240V. Common safety for CUL / CB / CCC / CE / FCC / KC / GOST R. Support OPP, OVP, OCP and SCP circuit protection.
XEON 3.4G 8M 1151P 4CORE E-2124G Intel Xeon E-2124G. 3.4 GHz. 8 MB Cache. FCLGA1151.
32GB DDR4 SODIMM-3200 2GbX8 SAM 32GB. Speed 3200MHz. 30u" Gold Plating Thickness. Anti-sulfurization resistance. Unbuffered.
APACER M.2 2280 NVME G4x4 1TB -25°C ~ +85 °C PCIe Gen4 x 4 interface. Temperature Range -25°C ~ +85 °C. NVMe Secure Erase. End-to-End Data Protection. Trusted Computing Group (TCG) Opal.
CORE I5 3G 18M 6C 1700P I5-12500 Intel Core i5-12500. 3 GHz. 18 MB Cache. FCLGA1700.
ADAPTEC 3101-4i 4pt 12Gb/s SAS PCIEx8 Supports RAID 0, 1, 5, 6, 10, 50, 60, 1 ADM and 10 ADM. 4 Ports (4 internal). 12 Gbps compatibility with SAS/SATA HDD or SSD devices. Supports up to 1 GB of high-speed DRAM cache.
32G ECC-SODDR4 3200 1.2V 2GbX8 SAM 32GB. Speed 3200MHz. 30u" Gold Plating Thickness. Anti-sulfurization resistance. ECC.
CORE I7 2.0G 16M 1200P 8C I7-10700TE Intel Core i7-10700TE. 2.0 GHz. 16 MB Cache. FCLGA1200.
CORE 2.4G 12M 1151P 6CORE I7-8700T Intel Core i7-8700T. 2.4 GHz. 12 MB Cache. FCLGA1151.
16GB ECC SO-DDR5-4800 2GX8 1.1V SAM Samsung Original Chip. Dual 32-bit Subchannels. Increased Banks and Burst Length. DDR5 4.8GT/s. Same-Bank Refresh. On-die ECC for Enhanced RAS.
CORE I5 2.3G 12M 1200P 6C I5-10500TE Intel Core i5-10500TE. 2.3 GHz. 12 MB Cache. FCLGA1200.
CORE 3G 9M 1151P 6C I5-9500E Intel Core i5-9500E. 3.0 GHz. 9 MB Cache. FCLGA1151.
(DEL21)4G DDR3-1600 512X8 1.35V MIC DDR3-1600. 240-Pin. 512MX8. Micron Chip.
80plus 2U-Redundant (1+1)R 500W (Delta) Full range AC input 100-240V. Common safety for CB / UL / FCC / CE / TUV / CCC / KC. Support OTP, OVP, OCP and SCP circuit protection. 80 Plus Bronze Available.
80plus Mini-Redundant (1+1)R 750W(FSP) Full range AC input 100-240V. Support PMBus v1.2. Common safety for CUL / CB / CCC / CE / FCC / TUV / BSMI. Support OTP, OVP and OCP circuit protection. 80 Plus Gold Available.
ADAPTEC 2100-8i HBA W/RAID 8P 12GB/S Full HBA functionality with basic hardware RAID. RAID levels 0, 1, 10, 5. 8 Ports (8 internal). Up to 12Gb/s throughput at each port.
CORE I3 3.2G 12M 4C 1700P I3-12100E Intel Core i3-12100E. 3.2 GHz. 12 MB Cache. FCLGA1700.
4G R-DDR4-2400 1.2V 512X8 SAM DDR4-2400 Registered DIMM. – standard height. 30μ" gold plating thickness (IPC-2221 Standard). 1.2V power consumption. Low-power auto self- refresh (LPASR). Provides better reliability, availability and serviceability (RAS) and improves data integrity.
Advantech 15.6" FHD Touch Panel Mount, EU+TW+US 15.6" active screen size. Support 10-point touch function (PCAP). Built-in Rich I/O interfaces for diverse connectivity. Easy to extend peripheral devices (box PC/camera...). Applicable for active stylus pen as optional accesory. Adopt advanced touch IC with CS10V capability for noise defense. Reach high...
2.5" SSD TLC BICS5 4TB 3D TLC. SATAIII. S.M.A.R.T. monitor. Read/Write: UP TO 560MB/500MB PERFORMANCE. OPTIMIZED FOR IPC, AND EDGE STORAGE.
KIOXIA SSSTC M.2 2280 256GB PCI-E Gen4x4 SSD TLC M.2 2280 form factor. PCIe link speed is Gen4x4. Supports dynamic wear leveling ,TRIM and garbage collection. Designed for embedded system.
Arc A310 4G PCIex8 4x HDMI Intel Xe Super Sampling technology. Integrated with 4GB GDDR6 memory. Supports PCIe 4.0 x 8 interface. Supports 4 x HDMI connectors. Supports DirectX 12, Vulkan, OpenGL 4.6, Open CL 3.0.
16GB ECC DDR5-4800 2GX8 1.1V SAM Samsung Original Chip. Dual 32-bit Subchannels. Increased Banks and Burst Length. DDR5 4.8GT/s. Same-Bank Refresh. On-die ECC for Enhanced RAS.
CORE 1.8G 12M 1151P 8C I7-9700TE Intel I7-9700TE. 1.8 GHz. 12 MB Cache. FCLGA1151.
4G DDR4-2666 512MbX8 1.2V SAM DDR4 2666Mhz Unbuffered UDIMM. 30μ" gold plating thickness. 1.2V power consumption. 100% tested for stability, compatibility and performance. Samsung original chip.
Seagate 2.5" 2TB SATAIII 5KRPM 128MB HDD 2 TB Storage. 5K RPM 128MB Cache. Ideal for General Storage Purpose. SATA Interface. 3 year limited warranty.
SG IPC 4TB 2.5" 5KRPM SATA3 128MB 4 TB Storage. 5K RPM 128MB Cache. Ideal for General Storage purpose. SATA Interface. 3 years warranty.
1U 1P KBM KB(USA EN)+TPAD COMBO 1U 19" Rackmount Keyboard Drawer. Single Console. 104-key keyboard with touchpad.
XEON 3.7G 12M 1151P 6CORE E-2176G Intel Xeon E-2176G. 3.7 GHz. 12 MB Cache. FCLGA1151.
APACER M.2 2280 NVME G4x4 256G -25°C ~ +85 °C PCIe Gen4 x 4 interface. Temperature Range -25°C ~ +85 °C. NVMe Secure Erase. End-to-End Data Protection. Trusted Computing Group (TCG) Opal.
Micron 5400 PRO 2.5" 480GB SATA3 3DTLC SATA 6 Gb/s interface. Micron 3D TLC NAND Flash. Hot-plug capable. ATA security feature command set and password login support. Endurance: Total bytes written (TBW) Up to 10512TB. Reliability : MTTF 3.0 million device hours.
Advantech 8G DDR5-4800 288Pin 1GX16 1.1V Unbuffered Samsung Chip Samsung Original Chip. Increased Banks and Burst Length. DDR5 4.8GT/s. Same-Bank Refresh. On-die ECC for Enhanced RAS.
XEON CPU 2.0G 42M 28C 4189P Gold 6330 Intel Xeon Gold 6330. 2.0 GHz. 42 MB Cache. FCLGA4189.
27" FHD PCAP Touch MNT, black, EU+TW+UK+US Power cord Support advanced 6-axis color adjustment for more accuracy image quality. Compliant with many touch methods including fingers, glove, and stylus via PCAP techology. Excellent touch noise immunity well-suited for rugged applications (CS 10Vrms). Anti-glare (AG) treatment on screen for comfortable...
19.0" XGA Panel Mount Monitor,EU,TW,UK,US 19.0" active screen size (Square). Full-flat cover glass for extremely simple surface design. Built-in multiple I/O interfaces for diverse media connectivity. Front IP65 water-proof rating and IK07 high-level impact protection. Support 10-point touch function (PCAP techology). Anti-glare surface glass provides...
Micron 5400 PRO 2.5" 3.8TB SATA3 3DTLC SATA 6 Gb/s interface. Micron 3D TLC NAND Flash. Hot-plug capable. ATA security feature command set and password login support. Endurance: Total bytes written (TBW) Up to 10512TB. Reliability : MTTF 3.0 million device hours.
CORE I7 1.4G 25M 12C 1700P I7-12700TE Intel Core i7-12700TE. 1.4 GHz. 25 MB Cache. FCLGA1700.
XEON 3.5G 20M 1200P 10C W-1290E Intel Xeon W-1290E. 3.5 GHz. 20 MB Cache. FCLGA1200.
Advantech 15" PCAP Touch Panel Mount, TW+US+EU 15.0" active screen size (Square). Full-flat cover glass for extremely simple surface design. Anti-glare (AG) treatment on screen for comfortable viewing experience. Built-in multiple I/O interfaces for diverse media connectivity. Adopts industrial-grade components for guaranteed performance. Mount with...
LR-LINK 10/100/1000M PCIEx4 4pt. RJ45 Quad RJ45 Ports. Supports 10/100/1000 Mbps per port. PCIe 2.1 (2.5 GT/s) x4. Standard CAT5 cabling with RJ45 connectors. Flexible I/O virtualization for port partitioning and QoS of up to 32 virtual ports.
32GB DDR5-5600 2GX8 1.1V SAM -20~85℃ SAM Original Chip. Industrial Design for Improved Reliability. PCB: 30μ gold finger. Anti-sulfuration. Semi Wide-temp Support -20~85℃.
Advantech 16GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip Hynix Original Chip. Increased Banks and Burst Length. DDR5 5.6GT/s. Same-Bank Refresh. On-die ECC for Enhanced RAS.
2.5" SSD TLC BICS5 256G 3D TLC. SATAIII. S.M.A.R.T. monitor. Read/Write: UP TO 560MB/500MB PERFORMANCE. OPTIMIZED FOR IPC, AND EDGE STORAGE.
CORE I3 2.1G 12M 4C 1700P I3-12100TE Intel Core i3-12100TE. 2.1 GHz. 12 MB Cache. FCLGA1700.
LITEON 18X SATA DVD-ROM BLACK(G) SMART-X function. ABS mechanism. Belt Tray Loading Mechanism. Easy-Tray design for both horizontal & vertical operation, supports both 8 cm & 12cm discs. Supports PIO mode 4, DMA mode 2 and ultra DMA mode 2.
80+ Bronze PS/2 SPS 250W ATX (FSP) RoHS Full range AC input 100-240V. Low ripple & noise. Support OTP, OVP and OCP circuit protection. Common safety for CB / CE / TUV / UL / FCC / KC / CCC. 80 Plus Available.
TRANSCEND mSATA mini 32GB MLC SAN mSATA Mini (Half Size) SATAIII (MO-300B Variation B Sandisk MLC NAND). Support TRIM, SMART, Bad Block Management, ECC, Wear Leveling. NOT compatible with Mini PCIe slot for WWAN/wireless cards. Suitable for embedded system use.
APACER 2.5" SATA 512G Bics5 TLC -25°C ~ +85 °C Low-Density Parity-Check (LDPC) Code. Temperature Range -25°C ~ +85 °C. End-to-End Data Protection. DataDefenderTM. Trusted Computing Group (TCG) Opal.
8G DDR4-3200 1GX8 1.2V SAM -20~85℃ SAM Original Chip. Industrial Design for Improved Reliability. PCB: 30μ gold finger. Anti-sulfuration. SEMI Wide-temp Support -20~85℃.
KIOXIA SSSTC NAS SSD 3.84TB 2.5" SATA3 TLC Bics5 High I/O and throughput performance. High reliability. Enhanced power-loss data protection. End to end Data Path Protection. DDR3 DRAM Cache embedded.
APACER M.2 2280 NVME G4x4 512G -25°C ~ +85 °C PCIe Gen4 x 4 interface. Temperature Range -25°C ~ +85 °C. NVMe Secure Erase. End-to-End Data Protection. Trusted Computing Group (TCG) Opal.
APACER M.2 2280 NVME G4x4 2TB -25°C ~ +85 °C PCIe Gen4 x 4 interface. Temperature Range -25°C ~ +85 °C. NVMe Secure Erase. End-to-End Data Protection. Trusted Computing Group (TCG) Opal.
SSSTC M.2 2242 512GB NVME G4 DRAMLESS SSD TLC M.2 2242 form factor. PCIe link speed is Gen4 x 4. Supports dynamic wear leveling ,TRIM and garbage collection. Designed for embedded system.
XEON 2.0G 45M 4677P 24C Gold 5418Y Intel® Xeon® Gold 5418Y. 2.0 GHz. 45 MB Cache. FCLGA4677.
16G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃ SAM Original Chip. Industrial Design for Improved Reliability. PCB: 30μ gold finger. Anti-sulfuration. Semi Wide-temp Support -20~85℃.
SSSTC M.2 2242 256GB NVME G4 DRAMLESS SSD TLC M.2 2242 form factor. PCIe link speed is Gen4 x 4. Supports dynamic wear leveling ,TRIM and garbage collection. Designed for embedded system.
