Qualcomm WCN7851 Wi-Fi 7 M.2 2230 BT-USB Industrial-grade temperature range (-40~85°C). Compatible with different platforms(NXP, Qualcomm, Intel & AMD). MLO(Multi-Link Operation) support. Multiple certification(FCC/CE/IC/TELEC/NCC/RCM).
SODIMM DDR5 5600 16GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
Qualcomm Wi-Fi 6E M.2 2230 E key Industrial-grade temperature range (-40~85°C). Compatible with Nvidia and NXP platforms. Additional 6GHz support. DBDC(Dual band dual concurrent) support. Multiple certificates (FCC/CE/IC/TELEC/KC/NCC).
SODIMM DDR3L 1600 8GB 512x8(0-85°C) Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
SQF mSATA SSD 650 256G 3D BiCS5 (0~70°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5" SSD 840-D 240G 3D BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Support AES256 and TCG-OPAL Compliant. Support HW Write Protection. Support LDPC with RAID ECC. GUI management tool & software API package. High Endurance sTLC Product Selection.
SQF 2.5 SATA SSD 830 256G MLC (0~70°C) Compliant with SATA III and SATA v3.2 standard. Supports 120 bit ECC correct per 2K Byte data. Supports Fragment Writing and Flush Manager. Optional support for AES and voltage stabilizer. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
204pin SODIMM DDR3L 1600 8GB 512x8(-40-85) Micro 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
Win 10 IoT Ent 2021 LTSC Value EPKEA Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and services...
SQF mSATA SSD 650 128G 3D BiCS5 (0~70°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
MIOe-PWR2-00A1E 9V-36V power module 9-36V DC to DC Power Module MI/O-Chassis compliant.
SQF mSATA 640 16G MLC (0~70°C) MO-300 mSATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
Win 10 IoT Ent 2019 LTSC Value EPKEA Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and services...
Bay Trail-I E3825, 2G RAM/VGA+LVDS, 3.5" Single Board Computer with PCI-104 Intel® Atom™ E3825 & Celeron® N2930, DDR3L-1066/1333MHz 2GB/4GB on-board memory. DirectX11, OpenGL3.2, OpenCL1.1, 3 independent display: VGA+LVDS/HDMI+LVDS*/Dual LVDS. Support PCI-104 expansion. 2 GbE, rich I/O: 4COM, SATA, USB3.0, SMBus/I2C, GPIO, full-size Mini PCIe,full-size...
SQF 2.5" SSD 640 32G MLC (0~70°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
Win10 IoT Ent 2016 LTSB Value EPKEA Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and services for...
intel BYT Celeron J1900 2.0GHz, 3.5" MIO Intel® Celeron J1900 & Atom™ E3825/E3845, DDR3L-1066/1333MHz SODIMM up to 8GB. DirectX11, OpenGL3.2, OpenCL1.2, multi-display: VGA+LVDS/eDP+ HDMI/ DP*. Flexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhow. 2 Intel i210 GbE, rich I/O: 4COM, SATA, USB3.0,...
SQF 2.5" SSD 640 64G MLC (-40~85°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
Celeron J1900 D1 2.0GHz VGA HDMI 4COM Intel® Celeron® J1900 Quad Core 2.0 GHz SoC. VGA and HDMI dual independent display. 12V lockable DC jack power input. 9-36V power module compatible with all-in-one ordering. -20 ~ 60 °C extend temperature operating. Mini PCIe expansion with SIM holder for communication module. mSATA and 1 x 2.5" SATA storage device....
SQF Half-Size mSATA 650 128G 3D TLC (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support Write Protection by customized. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
MIOe with 4xRS232/422/485 2xRS422/485 8-bit GPIO Full serial port: 4 x RS232 / 422 / 485, 2 x RS422 / 485. ±15kV ESD protection. Optional D-SUB connector or internal connector. Programmable 8-bit GPIO interface.
802.11ax+BT5.2, Realtek 8852BE, PCIe-USB, M.2 IEEE 802.11ax (2.4GHz+5GHz) + BT5.2. 2Tx / 2Rx. RTL8852BE. 22mm x 30mm x 2.2mm. M.2 2230 A-E Key. 0~70 degree. Wi-Fi: PCIe, BT: USB.
SQF mSATA 640 32G MLC (0~70°C) MO-300 mSATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
Win 11 IoT Ent LTSC 2024 Entry EPKEA Universal Windows Platform (UWP). Consistent Device Management. Enterprise Grade Security. Advanced Lockdown Features. Interoperability Aross Devices. Microsoft Azure IoT Services. Supporting USB4.0 and Wi-Fi 6E. Trusted Platform Module (TPM) 2.0 Requirement. Exclusive Value-Added Tools - Advantech Power Suite.
SQF M.2 2280 SSD 650 128G 3D BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5 SATA SSD 830 512G MLC (-40~85°C) Compliant with SATA III and SATA v3.2 standard. Supports 120 bit ECC correct per 2K Byte data. Supports Fragment Writing and Flush Manager. Optional support for AES and voltage stabilizer. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
BT N2930 A2 PC104+/VGA+LVDS/6USD/3COM Intel® Atom™ E3825/E3845 & Celeron® N2930, DDR3L-1066/1333MHz SODIMM up to 8GB. DirectX11, OpenGL3.2, OpenCL1.1, 3 independent display: VGA+LVDS/HDMI+LVDS/DVI+LVDS/VGA+LVDS. Support PC/104-Plus expansion. Rich I/O: 1 GbE, 3 COM, SATA, 6 USB2.0, SMBus/I2C, GPIO, full-size Mini PCIe/full-size mSATA. Supports iManager,...
Win 10 IoT Ent 2019 LTSC Entry Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and services for...
Intel RPL-S H610E 4LAN+8USB+8COM, 9-36V Support Intel® 12th/13th/14th Gen. Core™ i3/i5/i7/i9 processor. Dual display: HDMI + HDMI. DDR5 SO-DIMM memory support up to 64 GB. 9-36VDC wide range power input. Support 2 x 2.5" hard drive bays. Support up to 4GbE, 8USB, 8COM, 16bit DIO, 2CANBus, TPM2.0. SUSI API, WISE-DeviceOn, McAfee and Acronis bundled....
SQF M.2 2280 SSD 650 64G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF mSATA SSD 650 256G 3D BiCS5 (-20~85°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF HS mSATA 640-C 64G 3D sTLC BiCS4 (0 Half-Size Mini PCIe Form Factor. Interface: SATA Gen. 3. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC of ECC correct. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
Dual Intel I210 GbE LAN iDoor, 2-Ch, PCIe I/F PCIe to 2 x Ch PCIe to GigaLAN ethernet module. Support full duplex operation at 10/100/1000 Mb/s. Full size MiniPCIe type. Compliant with PCI Express TM 2.1. Compliant with 1Gb/s IEEE 802.3, 802.3u, 802.3ab. Wide temperature from -20 to 60 degree. Supports ARK series platforms:...
miniITX LGA1151 VGA/DP/DVI/LVDS/PCIe/2GbE Supports Intel® 6th & 7th Gen Core™ i processor (LGA1151) with Intel H110 chipset. Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM. Supports PCIe x 16 (Gen 3), 1 F/S miniPCIe, 1 M.2 2242 , 4 USB 3.0, 6 USB2.0 and 2 SATA III. Supports dual display of DP/DVI/VGA/LVDS(optional). Supports TPM 1.2 / 2.0 (optional)....
SODIMM DDR3L 1866 4GB (-40-85) Tier one original Samsung chip adopted. Data transfer rate: 1600MT/s. 3yrs longevity & lifetime warranty. Operating Temperature: -20 °C ~ 85 °C. Free Intelligent software monitor DRAM real time information. .
SQF HS mSATA 640 64G MLC (0~70°C) Half-Size Mini PCIe Form Factor. Interface: SATA Gen. 3. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
intel BYT Atom E3845 1.91GHz, wide temp heatsink Intel® Celeron J1900 & Atom™ E3825/E3845, DDR3L-1066/1333MHz SODIMM up to 8GB. DirectX11, OpenGL3.2, OpenCL1.2, multi-display: VGA+LVDS/eDP+ HDMI/ DP*. Flexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhow. 2 Intel i210 GbE, rich I/O: 4COM, SATA,...
BT-I E3845 A2 PC104+/VGA+LVDS/6USD/3COM -40~85C Intel® Atom™ E3825/E3845 & Celeron® N2930, DDR3L-1066/1333MHz SODIMM up to 8GB. DirectX11, OpenGL3.2, OpenCL1.1, 3 independent display: VGA+LVDS/HDMI+LVDS/DVI+LVDS/VGA+LVDS. Support PC/104-Plus expansion. Rich I/O: 1 GbE, 3 COM, SATA, 6 USB2.0, SMBus/I2C, GPIO, full-size Mini PCIe/full-size mSATA. Supports...
MiniITX ADL-S LGA1700 H610E/LVDS/PCIex16 Gen4/D4 12th/13th Gen Intel® Core™ Desktop Processors, max. 24Core, support H610E chipset. Up to 64GB DDR4 3200MT/s with two SO-DIMM. PCIe x16 Gen4. Triple independent displays with 2 DP, 1 HDMI, 1 LVDS. Rich expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen1x1 & 6 USB2.0, 2 SATA III and 6 COM. WISE-DeviceOn and...
EMIO-210S-MPU01E A101-1, 2-CH RS232 mod USB to 2-Ch High Speed RS-232 port module. Full size Mini PCIe & Module type combo. MiniPCIe thru USB & USB Pin Header. FIFO buffer 4K byte transfer, 4K byte receiver. Widely temperature from -40 ~ 85 degree.
Celeron J1900 D1 2.0GHz 9-36VDC VGA HDMI Intel® Celeron® J1900 Quad Core 2.0 GHz SoC with Turbo boost support. VGA and HDMI dual independent display. 9 ~ 36 VDC wide range power input. -20 ~ 70° C extend temperature operating. Mini PCIe expansion with SIM holder for communication module. mSATA and 1 x 2.5" SATA storage device. Advantech iDoor module...
SQF 2.5" SSD 640 128G MLC (0~70°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
5G NR FR1 module, M.2 3052 Key B, USB only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...
SQF mSATA 640-C 64G 3D sTLC BiCS4 (-40~ MO-300 mSATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC of ECC correct. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
SQF 2.5" SSD 640 256G MLC (0~70°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
SODIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
4G LTE Cat4. + GNSS module with mPCIe form factor, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module, with GPS, for EU, for TW, for...
Intel E8000 SBC,DDR3L,HDMI,VGA,LVDS,mSATA Intel® Celeron QC/DC SoC, Intel® Atom QC, DDR3L-1600MHz SODIMM up to 8GB. DirectX11.1, OpenGL4.2, OpenCL1.2, 3 independent display: VGA + HDMI + LVDS/eDP*. Rich I/O: 4 x COM, 2 x SATA, 2 x USB3.0, 4 x USB2.0, TPM2.0, SMBus/I2C, GPIO, full-size Mini PCIe w/ SIM holder, full-size mSATA. Supports iManager, SUSI...
miniITX LGA1151 wH310/DP/HDMI/PCIe/3GbE,RoHS Supports Intel® 8th/9th Gen Core™ i processor (LGA1151) with Intel H310 chipset. Two 260-pin SO-DIMM up to 64GB DDR4 2666 MHz SDRAM. Supports PCIe x 4 (Gen 3), 1 M.2 B key, 1 M.2 E key, 6 COM, 4 USB 3.0 and 3 SATA III. Supports dual display of DP/HDMI/LVDS(or eDP). Supports TPM 1.2 / 2.0 (optional). THIN...
Win 11 IoT Ent LTSC 2024 Value EPKEA Universal Windows Platform (UWP). Consistent Device Management. Enterprise Grade Security. Advanced Lockdown Features. Interoperability Aross Devices. Microsoft Azure IoT Services. Supporting USB4.0 and Wi-Fi 6E. Trusted Platform Module (TPM) 2.0 Requirement. Exclusive Value-Added Tools - Advantech Power Suite.
Win 11 IoT Ent LTSC 2024 Entry Universal Windows Platform (UWP). Consistent Device Management. Enterprise Grade Security. Advanced Lockdown Features. Interoperability Aross Devices. Microsoft Azure IoT Services. Supporting USB4.0 and Wi-Fi 6E. Trusted Platform Module (TPM) 2.0 Requirement. Exclusive Value-Added Tools - Advantech Power Suite.
WinSvrIoT 2019 Std 4 Core NoMedia/NoKey AddLic Includes advanced security features to protect IoT devices and edge computing systems from threats. Offers tools for remote device management, simplifying the control of IoT devices and edge servers. Supports containers, including Docker containers, simplifying application deployment and management....
SQF 2.5" SSD 650 64G 3D BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
Intel J1900 QC 2.0GHz D1 ADP 62368, TI Intel® Celeron J1900 Quad Core 2.0 GHz SoC. 1 x 2.5" SATA HDD/SSD Bay. 2 x GbE for Multiple Internet Transmission. 2 x Independent HDMI. 1 x RS-232/422/485 (BIOS selection). 1 x Full-Size MiniPCIe (ex. WLAN or WWAN module). 1 x Half Size mSATA. Optional VESA / DIN Rail / Wall Mounting kits. Threaded DC jack design....
LGA1700 mATX (RPL)R680E 2DP/HDMI/8SATA/6COM/TPM Intel® Core™ 14/13/12th gen i9/i7/i5/i3 processors with Q670E/ R680E/ H610E chipsets. 3 2.5GbE LAN and 1 GbE LAN for digital devices. Up to 192GB DDR5 UDIMMs for data transfer. High speed expansions: PCIe x16 Gen5, 8 USB3.2, 1 USB3.2 Type C. 1 internal USB3.2 type A to support USB keylock functions. Quad...
Win 10 IoT Ent 2021 LTSC Value Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and services for...
BT-I E3825 A2 PC104+/VGA+LVDS/6USD/3COM -40~85 Intel® Atom™ E3825/E3845 & Celeron® N2930, DDR3L-1066/1333MHz SODIMM up to 8GB. DirectX11, OpenGL3.2, OpenCL1.1, 3 independent display: VGA+LVDS/HDMI+LVDS/DVI+LVDS/VGA+LVDS. Support PC/104-Plus expansion. Rich I/O: 1 GbE, 3 COM, SATA, 6 USB2.0, SMBus/I2C, GPIO, full-size Mini PCIe/full-size mSATA. Supports...
A2 2.5" UIO SBC NXP i.MX8M Plus Quad, 6GB, 0~60° NXP Arm® Cortex®-A53 i.MX8M Plus Quad/Dual up to 1.8 GHz. Onboard LPDDR4 4 GB / 6 GB, 4000MT/s memory. HDMI 1920x1080 at 60Hz, 1 Single or 1 Dual Channel 24 bit LVDS (or 1 4-Lane MIPI-DSI by BOM Option). 1 4-wire RS-232/422/485, 1 USB3.2 Gen1 By 1, 1 USB2.0, 1 Micro SD, 1 Mic. in / Line out. 1 mini-PCIe...
BT-I E3825 A2 PC104+/VGA+LVDS/6USD/3C Intel® Atom™ E3825/E3845 & Celeron® N2930, DDR3L-1066/1333MHz SODIMM up to 8GB. DirectX11, OpenGL3.2, OpenCL1.1, 3 independent display: VGA+LVDS/HDMI+LVDS/DVI+LVDS/VGA+LVDS. Support PC/104-Plus expansion. Rich I/O: 1 GbE, 3 COM, SATA, 6 USB2.0, SMBus/I2C, GPIO, full-size Mini PCIe/full-size mSATA. Supports iManager,...
Win 11 IoT Ent 2024 LTSC HighEnd Universal Windows Platform (UWP). Consistent Device Management. Enterprise Grade Security. Advanced Lockdown Features. Interoperability Aross Devices. Microsoft Azure IoT Services. Supporting USB4.0 and Wi-Fi 6E. Trusted Platform Module (TPM) 2.0 Requirement. Exclusive Value-Added Tools - Advantech Power Suite.
12.1" LED panel 1200N 800x600(G) with 5W touch 12.1” LCD supports 800 x 600 and 1024 x 768 pixels. Ultra-high brightness of 1200cd/m2 with LED backlight. -20℃~+70℃ wide operating temperature support. High contrast ratio. Superior sunlight readability. LVDS signal interface. AR surface treatment (Optional). Manually VR brightness control (Optional)....
802.11ax+BT5.3, NXP 88W9098, PCIe-UART, M.2 2830 NXP 88W9098. 2Tx/2Rx. IEEE 802.11 a/b/g/n/ac/ax (2.4GHz/5GHz) + BT 5.3. Form factor: M.2 2830 E key. Wi-Fi: PCIe; Bluetooth: UART. OS: Linux. Operating Temp: -40 ~ 85 °C (-40 ~ 185 °F). 28 x 30 x 3.95 mm (1.10 x 1.18 x 0.15 in). IC: NXP 88W9098.
SODIMM DDR5 5600 8GB 1Gx16 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
MIO-2263 A2 BayTrail-D J1900, VGA Embedded Intel® Atom™ SoC E3825 & Celeron J1900 up to Quad-Core processor design, DDR3L 1333MHz support up to 8GB. Intel Gen 7 DirectX®11.1 support, dual independent display by 24-bit LVDS + VGA or 24-bit LVDS + HDMI. Flexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain...
SQF mSATA 640 64G MLC (-40~85°C) MO-300 mSATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
Intel Rapter Lake i5 1335UE +2x2.5 GbE+1xGbE+6USB+6COM Intel 13th Gen Intel® Core™ U-series 10 cores (2 P-cores and 8 E-cores) SoC. 2x 2.5 GbE LAN, 1x GbE LAN, 6x USB 3.1, 6x RS-232/422/485, 2x HDMI and 2x CANBus. Dual Channel DDR5-4800 memory up to 64GB. Support NVMe storage devices with PCIe Gen 4x4. 12-24V DC wide range power input. -20-60°C wide...
MiniITX ADL-N N97 BGA 12W 4C Intel® Core™ i3, N series and Atom® x7000E/x7000RE Series . Up to 32GB DDR4 3200MT/s SODIMM. Triple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP). Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COM. THIN Mini-ITX low profile I/O stack design, fanless...
Win 10 IoT 2021 Ent LTSC Base Arm64 EPKEA Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and...
Intel Core i5-1145G7E HDMI+VGA+3*GbE+4*COM Intel 11th Gen. Core i5/i3. DIN-Rail system with essential I/O ports on front-side bezel. 3 x Intel GbE, 4x RS-232/422/485. 3 x USB 3.2 and 3 x USB 2.0, dual independent displays with one 4K HDMI and one VGA. 3 Expansion: M.2 E-Key 2230, M.2 B-Key 2280, 1 x Full-size mSATA share with mPCIe slot. mSATA and 1 x...
Win 10 IoT Ent 2019 LTSC High End Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and services for...
mPCIe Intel Movidius X AI module with 1 VPU. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks. Scalable for multi video streams edge inference. 10 times the performance compared to previous generation. Intel® OpenVINO™ toolkit fully supported.
Win 10 IoT 2021 Ent LTSC Base Arm64 PKEA Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and...
Win 10 IoT Ent 2021 LTSC High End Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and services for...
MIO-5152 A101-3 EKL J6412, LVDS+DP+HDMI, E-Key Atom® x6000E series and Intel® Celeron® J and N series with Quad/Dual Cores, TDP 6W/ 10W/ 12W. Single Channel DDR4-3200 up to 32G. Support 3 independent displays via LVDS, DP1.4, and HDMI2.0 up to 4K@60Hz. Dual GbE, 6 USB, 6 UART, TPM2.0. CE/FCC Class B, Coastline I/O ESD 8KV/15KV Criteria A. Support Windows...
Intel Atom E3940 F1 1.6GHz VGA HDMI 4COM Intel Atom E3940 Quad Core Soc. Dual independent displays with one 4K HDMI and one VGA. 12V lockable DC jack power input. 9-36V power module compatible with all-in-one ordering. -20 ~ 60 °C extend temperature operating. Mini PCIe expansion with SIM holder for communication module. M.2 NGFF 2230 E Key for Wifi...
12/13th Gen Intel Core i3/i5/i7/i9 H610E PCIex4+PCIex16, 9-36V Support Intel® 12th & 13th Gen. Core™ i3/i5/i7/i9 processor. Triple independent display: HDMI + HDMI + Optional Display. DDR5 SO-DIMM memory support up to 64 GB. 9-36VDC wide range power input. Up to 3sets 2.5" hard drive bays, support Intel® SW RAID. Support up to 4GbE, 8USB, 8COM, 16bit...
SODIMM D4 3200 16GB (0-85) 2Gx8 Hynix Original Hynix IC chips adopted. Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. Lifetime warranty.
SQF 2.5" SSD 840-D 3840G 3D BiCS5 (-40~85°C) Compliant with SATA III and SATA v3.2 standard. Support AES256 and TCG-OPAL Compliant. Support HW Write Protection. Support LDPC with RAID ECC. GUI management tool & software API package. High Endurance sTLC Product Selection.
Intel Atom E3940 F1 QC 1.6GHz 2HDMI 62368 adp. Intel Atom E3940 Quad Core SoC. Dual HDMI independent display support 4k2k resolution. 1 x M.2 E Key for WIFI module. TPM built in for well security. -20 ~ 60 °C extended operating temperature. Optional 12~24V power module (Dual Layer). Advantech iDoor module compatible (Dual Layer). Advantech WISE-DeviceOn...
Giga LAN Ethernet module, 1-Ch, PCIe I/F, PCIe to 1x Ch PCIe to GigaLAN ethernet module. Support full duplex operation at 10/100/1000 Mb/s. Full size MiniPCIe type. Compliant with PCI Express TM 2.1. Compliant with 1Gb/s IEEE 802.3, 802.3u, 802.3ab. Wide temperature from -40 to +85 degree.
SODIMM DDR5 5600 16GB 2Gx8 Samsung(-40~95) Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
Win 10 IoT Ent 2019 LTSC Value Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and services for...
ARK-3520P ,i7-6820EQ2.8GHz, 2PCI slots Intel® Core™ i3/i5/i7 processor (BGA). Triple independent display: VGA + HDMI + Option Display. DDR4 SO-DIMM memory up to 32 GB. Flexible Expansion via PCI/PCIex4. 9-36V wide range Power input. Versatile I/Os including 6 x high speed USB 3.0 and 8 x COM ports. 2 Removable 2.5" HDD drive bay. Advantech iDoor module...
CIRCUIT MODULE, PCIe x4 w/ 8x Intel Movidius X AI module Four/Eight Intel® Movidius™ Myriad™ X VPU onboard. Hardware acceleration for common deep neural networks. Scalable for multiple video streams edge inference. 10 times the performance compared to the previous generation. Intel® OpenVINO™ toolkit for inference performance optimization. Edge AI Suite...
Riser for ISMB,PCIex4+2 PCI+PCIex16 A101-2,RoHS Connecting Interface: PCIe x16 + PCIe x4. Expansion Slots: 1 PCIe x16 + 2 PCI.
MIO-2361 A101-2 APL-E3940 F1, RAM 4GB, eMMC 32G, Intel® Atom™ E3900 series/ Pentium N4200/Celeron N3350. Onboard LPDDR4-2400 up to 4GB, eMMC up to 64GB (TBC). Dual independent display by 48-bit LVDS+HDMI. M.2 E-key, mSATA/mPCIe for expansion. Dual GbE, USB3.0, 2 x RS-232/422/485, 12/24V input. Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite.
5G NR FR1 module, USB communication interface, with GNSS, for US Main Chipset Qualcomm SDX62. Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). AIW-356 DQ-N01: 5G NR FR1...
i7-8665UE, A101, LVDS+HDMI_-40~+85°C 8th Gen. Intel Core Processor with Quad/Dual Cores, TDP 15W. Dual Channel DDR4-2400 up to 32GB, onboard eMMC up to 64GB. Triple simultaneous displays by 48-bit LVDS/eDP+HDMI+DP. 2 GbE, 4 USB3.1, CAN Bus, M.2 M-Key 2280 supports NVMe, DC-in 12-24V. Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite.
MIO-2263 A2 BayTrail-I E3825, VGA Embedded Intel® Atom™ SoC E3825 & Celeron J1900 up to Quad-Core processor design, DDR3L 1333MHz support up to 8GB. Intel Gen 7 DirectX®11.1 support, dual independent display by 24-bit LVDS + VGA or 24-bit LVDS + HDMI. Flexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain...
Intel Atom x7211E w/ COM x4 USB x4 HDMI LAN x1 Intel® Atom® Processor x7211E Dual Core SoC. DDR5-4800 SO-DIMM memory support up 16G. Four Serial Ports. M.2 E Key, B Key and M Key for storage and wireless module installation. TPM for system security by option. -30 ~ 60 °C extended operating temperature. 12V lockable DC jack power input. Advantech DeviceOn...
Win 11 IoT Ent 2024 LTSC HighEnd EPKEA Universal Windows Platform (UWP). Consistent Device Management. Enterprise Grade Security. Advanced Lockdown Features. Interoperability Aross Devices. Microsoft Azure IoT Services. Supporting USB4.0 and Wi-Fi 6E. Trusted Platform Module (TPM) 2.0 Requirement. Exclusive Value-Added Tools - Advantech Power Suite.
MI/O module, 4 COM, isolation, powered COM, 2USB 4 COM support with ±15kV air gap ESD protection: COM1: RS-232/422/485 (Isolation , RS-485 auto flow control), COM2: RS-232/422/485 (Wake on Ring, RS-485 auto flow control, supply 12V/5V power selected by jumper), COM3/4: RS-232 (Wake on Ring). Support 2 x USB2.0 by internal box wafer connector. Optional...
Qualcomm Wi-Fi6E industrial grade solution Industrial-grade temperature range (-40~85°C). Compatible with Nvidia and NXP platforms. Additional 6GHz support. DBDC(Dual band dual concurrent) support.
NXP i.MX6 A2 QSeven Module (dual core, 0 NXP ARM Cortex™-A9 i.MX6 Dual 1 GHz high performance processor. Onboard DDR3 1 GB. Onboard eMMC NAND Flash 16 GB. Supports OpenGL ES 2.0 and OpenVG™ 1.1 hardware accelerators, full HD 1080p video codec. VGA, HDMI, 24bit LVDS. 2 CAN, 4 UART, 2 I2C, 8 GPIO. 2 USB, 1 SD/eMMC. 1 10/100/1000 Mbps Ethernet; 1 PCIe x 1,...
Office LTSC 2021 Embedded ESD OLC No internet hacking risk, no windows update hassle. Local production, global selling and deployment. Physical COA stickers for stock management and compliance cofidence. Fixed functionality and security update. Perpetual software license.
i.MX8ULP OSM V1.1 S module, 1GB DDR, 16GB eMMC NXP Arm® Cortex®-A35 i.MX 8ULP Dual up to 1.0 GHz. 1 x Arm Cortex-M33 core. Onboard LPDDR4 1GB, 2000MT/s memory. 1 x 4 lane MIPI-DSI. 1 x USB2.0, 1 x USB 2.0 OTG, 5 x UART, 2 x I2C, 24 x GPIO, 6 x PWM, 1 x CAN. Ultra small size form factor - OSM. Support Ycoto Linux.
Win 10 IoT Ent 2021 LTSC High End EPKEA Customizable and flexible platform for building embedded and IoT devices. Support for a variety of processors, including x86, x64, ARM, and more. Advanced security features such as Device Guard, BitLocker, and Secure Boot. Seamless integration with existing infrastructure and devices. Rich set of tools and services...
i3-1115G4E PCIe x4 11th Generation Intel® Core™ Processor U-Series. COM Express R3.0 Compact Module Type 6 Pinout. Dual channel with one memory down and one SODIMM. High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2. Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional). Supports SUSI, DeviceOn and Edge AI Suite.
Win Server IoT 2019 Standard (20 Core) Includes advanced security features to protect IoT devices and edge computing systems from threats. Offers tools for remote device management, simplifying the control of IoT devices and edge servers. Supports containers, including Docker containers, simplifying application deployment and management. Seamlessly...
AIMB-U233 Intel® Core™ i3-8145UE (eDP) Intel® Whisky Lake Core™ i3-8145UE / i5-8365UE / i7-8665UE. Supports 1 x DDR4-2400 SO-DIMM. Supports 1 x eDP (LVDS co-lay), 2 x HDMI, 3 Independent Displays. Supports 2 x LAN, 2 x USB3.1 Gen2 Type-A Ports, 4 COM Ports (RS-232/422/485, selected via BIOS). Supports 1 x M.2 E-Key, 1 x M.2 B-Key, 1 x M.2 M-Key NVMe....