New products

Core Ultra 7 255U 1.7GHz, 4xGbE, 6xUSB, 4xCOM Intel® Core™ Ultra Processors (Series 2), including Ultra 5 225U & Ultra 7 255U (formerly Arrow Lake). Wide operating temperature: -20 ~ 60 °C; power input: 10 ~ 36 VDC. Up to four display outputs (DP + HDMI + 2 x Type-C). 4 x LAN, 3 x USB 3.2 Gen2, 1 x USB 2.0, 2 x Type-C. 4 x RS-232/422/485. 2 x M.2 M-key,...

SQF M.2 2280 FIPS SSD 840F 2T BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Support LDPC with RAID ECC. Support AES-256 and FIPS verify. Shock resistance, anti-vibration.

Core Ultra 5 225U 1.5GHz, 4xGbE, 6xUSB, 4xCOM Intel® Core™ Ultra Processors (Series 2), including Ultra 5 225U & Ultra 7 255U (formerly Arrow Lake). Wide operating temperature: -20 ~ 60 °C; power input: 10 ~ 36 VDC. Up to four display outputs (DP + HDMI + 2 x Type-C). 4 x LAN, 3 x USB 3.2 Gen2, 1 x USB 2.0, 2 x Type-C. 4 x RS-232/422/485. 2 x M.2 M-key,...

ARK-3534D w/ CPU/RAM/SSD/OS for ABB High-performance AI computing: Equipped with the Core i7-13700TE and NVIDIA RTX 2000 Ada.. Advanced real-time networking: Features a 10GbE adapter and 2.5G TSN functionality.. High-speed storage: Includes a built-in 1 TB NVMe SSD.. Extensive industrial connectivity: Offers up to 8 COM serial ports and optional CANBus...

USM-300 Dual Layer w/i9, DDR 16G, M.2 512G, 360W Stylish and user-friendly outlook for hospital environment. Support Intel® 13th Gen Core™ i7/i5/i3 processor with Intel R680E. Rich expansion for multi-purpose application. Support Window 10/11/LTSC/Linux/NVidia AI (Clara SDK). M.2 2280 expansion slot. Scalable for single and dual layer design. Support...

RDIMM DDR4 3200 32GB 2Gx8,ECC, register(-25-85C) Original Hynix IC chip adopted. Wide operating temperature support -25~85oC. Data transfer rate up to 3200 MT/s.

APACER M.2 2280 NVME G4x4 256G -25°C ~ +85 °C PCIe Gen4 x 4 interface. Temperature Range -25°C ~ +85 °C. NVMe Secure Erase. End-to-End Data Protection. Trusted Computing Group (TCG) Opal.

ARK-3534D w/ CPU/RAM/SSD/OS/Fan kit/PSU for ABB High-performance AI computing: Equipped with the Core i7-13700TE and NVIDIA RTX 2000 Ada.. Advanced real-time networking: Features a 10GbE adapter and 2.5G TSN functionality.. High-speed storage: Includes a built-in 1 TB NVMe SSD.. Extensive industrial connectivity: Offers up to 8 COM serial ports and...

SODIMM DDR5 6400 48GB 3Gx8 (-25-95) Hynix Data Transfer Rate: 6400 MT/s. Capacity : 8/16/32/48/64GB. Original Hynix IC adopted. On-Die ECC function support. Independent Power Management IC build-in. CKD& TVS Diode on Module. Operating Temperature: -25°C ~ 95°C.

SODIMM DDR5 6400 64GB 4Gx8 (-25-95) Hynix Data Transfer Rate: 6400 MT/s. Capacity : 8/16/32/48/64GB. Original Hynix IC adopted. On-Die ECC function support. Independent Power Management IC build-in. CKD& TVS Diode on Module. Operating Temperature: -25°C ~ 95°C.

APACER 2.5" SATA 512G Bics5 TLC  -25°C ~ +85 °C Low-Density Parity-Check (LDPC) Code. Temperature Range -25°C ~ +85 °C. End-to-End Data Protection. DataDefenderTM. Trusted Computing Group (TCG) Opal.

SOM-D580D16-U0A1 w/Phoenix -40~85C COM-HPC® Server Size D Module. Intel® Xeon® D-2700 processors. Up to 20 Cores, 30MB LLC Cache, 118W TDP. Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC). 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB. Supports iManager, Embedded Software APIs, and WISE-DeviceOn.

USM-300 Single Layer w/i9/DDR 16G. M.2 512G,360W Stylish and user-friendly outlook for hospital environment. Support Intel® 13th Gen Core™ i7/i5/i3 processor with Intel R680E. Rich expansion for multi-purpose application. Support Window 10/11/LTSC/Linux/NVidia AI (Clara SDK). M.2 2280 expansion slot. Scalable for single and dual layer design. Support...

SODIMM DDR5 6400 16GB 2Gx8 (-25-95) Hynix Data Transfer Rate: 6400 MT/s. Capacity : 8/16/32/48/64GB. Original Hynix IC adopted. On-Die ECC function support. Independent Power Management IC build-in. CKD& TVS Diode on Module. Operating Temperature: -25°C ~ 95°C.

8G DDR4-3200 1GX8 1.2V SAM -20~85℃ SAM Original Chip. Industrial Design for Improved Reliability. PCB: 30μ gold finger. Anti-sulfuration. SEMI Wide-temp Support -20~85℃.

SQF M.2 2280 FIPS SSD 840F 1T BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Support LDPC with RAID ECC. Support AES-256 and FIPS verify. Shock resistance, anti-vibration.

SQF M.2 2280 FIPS SSD 840F 256G BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Support LDPC with RAID ECC. Support AES-256 and FIPS verify. Shock resistance, anti-vibration.

APACER M.2 2280 NVME G4x4 1TB -25°C ~ +85 °C PCIe Gen4 x 4 interface. Temperature Range -25°C ~ +85 °C. NVMe Secure Erase. End-to-End Data Protection. Trusted Computing Group (TCG) Opal.

DS-011,QCS6490,HDMI x 2 Power by Qualcomm Dragonwing™ 8-cores QCS6490 2.1Ghz. Hexagon™ 770 AI Engine up to 12 TOPS. Triple-ISP for camera up to 192MP capture. Qualcomm AI Hub for Application development. Dual HDMI 4K Display Support. Dual LAN,RS232&USBports.

KIOXIA SSSTC NAS SSD 3.84TB 2.5" SATA3 TLC Bics5 High I/O and throughput performance. High reliability. Enhanced power-loss data protection. End to end Data Path Protection. DDR3 DRAM Cache embedded.

DS-011,QCS6490,HDMI x 2,GMSL x 2 Power by Qualcomm Dragonwing™ 8-cores QCS6490 2.1Ghz. Hexagon™ 770 AI Engine up to 12 TOPS. Triple-ISP for camera up to 192MP capture. Qualcomm AI Hub for Application development. Dual HDMI 4K Display Support. Dual LAN,RS232&USBports.

SODIMM DDR5 6400 32GB 2Gx8 (-25-95) Hynix Data Transfer Rate: 6400 MT/s. Capacity : 8/16/32/48/64GB. Original Hynix IC adopted. On-Die ECC function support. Independent Power Management IC build-in. CKD& TVS Diode on Module. Operating Temperature: -25°C ~ 95°C.

8GE + 4SFP Port Managed Ethernet Switch Certified to IEC 62443-4-2 SL2. 8 Gigabit ports + 4 SFP ports. Redundancy: X-Ring Pro (ultra high-speed recovery time < 20 ms), RSTP/STP (802.1w/1D). IXM function enables fast deployment. Security: 802.1x (Port-Based, MD5/TLS/TTLS/PEAP Encryption), RADIUS. NEMA TS2 for Traffic Control. EN50121-4 approval for...

SODIMM DDR5 6400 8GB 1Gx16 (-25-95) Hynix Data Transfer Rate: 6400 MT/s. Capacity : 8/16/32/48/64GB. Original Hynix IC adopted. On-Die ECC function support. Independent Power Management IC build-in. CKD& TVS Diode on Module. Operating Temperature: -25°C ~ 95°C.

16G DDR4-3200 1GX8 1.2V SAM -20~85℃ SAM Original Chip. Industrial Design for Improved Reliability. PCB: 30μ gold finger. Anti-sulfuration. SEMI Wide-temp Support -20~85℃.

20MS/s, 14-bit, 4-ch Analog input PCIE Card 8 or 4 x Simultaneously Analog Inputs, up to 20 MS/s. 14-bit resolution. Supports digital and analog triggers. Wide input range up to 20 Vpp (±10 V range). Onboard FIFO memory (65,536 samples).

APACER M.2 2280 NVME G4x4 512G -25°C ~ +85 °C PCIe Gen4 x 4 interface. Temperature Range -25°C ~ +85 °C. NVMe Secure Erase. End-to-End Data Protection. Trusted Computing Group (TCG) Opal.

20MS/s, 14-bit, 8-ch Analog input PCIE Card 8 or 4 x Simultaneously Analog Inputs, up to 20 MS/s. 14-bit resolution. Supports digital and analog triggers. Wide input range up to 20 Vpp (±10 V range). Onboard FIFO memory (65,536 samples).

APACER M.2 2280 NVME G4x4 2TB -25°C ~ +85 °C PCIe Gen4 x 4 interface. Temperature Range -25°C ~ +85 °C. NVMe Secure Erase. End-to-End Data Protection. Trusted Computing Group (TCG) Opal.

SQF M.2 2280 FIPS SSD 840F 512G BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Support LDPC with RAID ECC. Support AES-256 and FIPS verify. Shock resistance, anti-vibration.