SODIMM DDR5 5600 16GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR3L 1600 8GB 512x8(0-85°C) Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
SQF mSATA SSD 650 256G 3D BiCS5 (0~70°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5" SSD 840-D 240G 3D BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Support AES256 and TCG-OPAL Compliant. Support HW Write Protection. Support LDPC with RAID ECC. GUI management tool & software API package. High Endurance sTLC Product Selection.
SQF 2.5 SATA SSD 830 256G MLC (0~70°C) Compliant with SATA III and SATA v3.2 standard. Supports 120 bit ECC correct per 2K Byte data. Supports Fragment Writing and Flush Manager. Optional support for AES and voltage stabilizer. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
204pin SODIMM DDR3L 1600 8GB 512x8(-40-85) Micro 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SQF mSATA SSD 650 128G 3D BiCS5 (0~70°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF mSATA 640 16G MLC (0~70°C) MO-300 mSATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
SQF 2.5" SSD 640 32G MLC (0~70°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
SQF 2.5" SSD 640 64G MLC (-40~85°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
SQF Half-Size mSATA 650 128G 3D TLC (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support Write Protection by customized. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF mSATA 640 32G MLC (0~70°C) MO-300 mSATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
SQF M.2 2280 SSD 650 128G 3D BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5 SATA SSD 830 512G MLC (-40~85°C) Compliant with SATA III and SATA v3.2 standard. Supports 120 bit ECC correct per 2K Byte data. Supports Fragment Writing and Flush Manager. Optional support for AES and voltage stabilizer. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
SODIMM DDR5 5600 8GB 1Gx16 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SQF M.2 2280 SSD 650 64G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF mSATA SSD 650 256G 3D BiCS5 (-20~85°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF HS mSATA 640-C 64G 3D sTLC BiCS4 (0 Half-Size Mini PCIe Form Factor. Interface: SATA Gen. 3. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC of ECC correct. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
SODIMM DDR3L 1866 4GB (-40-85) Tier one original Samsung chip adopted. Data transfer rate: 1600MT/s. 3yrs longevity & lifetime warranty. Operating Temperature: -20 °C ~ 85 °C. Free Intelligent software monitor DRAM real time information. .
SQF HS mSATA 640 64G MLC (0~70°C) Half-Size Mini PCIe Form Factor. Interface: SATA Gen. 3. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
EMIO-210S-MPU01E A101-1, 2-CH RS232 mod USB to 2-Ch High Speed RS-232 port module. Full size Mini PCIe & Module type combo. MiniPCIe thru USB & USB Pin Header. FIFO buffer 4K byte transfer, 4K byte receiver. Widely temperature from -40 ~ 85 degree.
SQF 2.5" SSD 650 64G 3D BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5" SSD 640 128G MLC (0~70°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
SQF mSATA 640-C 64G 3D sTLC BiCS4 (-40~ MO-300 mSATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC of ECC correct. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
SQF 2.5" SSD 640 256G MLC (0~70°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
SODIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SQF mSATA 640 64G MLC (-40~85°C) MO-300 mSATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
SODIMM D4 3200 16GB (0-85) 2Gx8 Hynix Original Hynix IC chips adopted. Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. Lifetime warranty.
SQF 2.5" SSD 840-D 3840G 3D BiCS5 (-40~85°C) Compliant with SATA III and SATA v3.2 standard. Support AES256 and TCG-OPAL Compliant. Support HW Write Protection. Support LDPC with RAID ECC. GUI management tool & software API package. High Endurance sTLC Product Selection.
SODIMM DDR5 5600 16GB 2Gx8 Samsung(-40~95) Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
SODIMM DDR5 5600 32GB 2Gx8 Samsung(-40~95) Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
SQF 2.5" SSD 640 64G MLC (0~70°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
SQF 2.5" SSD 650 32G 3D sTLC BiCS5 (-40~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5" SSD 840V-D 240G 3D BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support HW Write Protection. Support LDPC with RAID ECC. GUI management tool & software API package.
SQF 2.5" SSD 650 256G 3D sTLC BiCS5 (-40~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5" SSD 840-C 240G 3D BiCS4 sTLC(- Compliant with SATA III and SATA v3.2 standard. Support AES256 and TCG-OPAL Compliant. Support HW Write Protection. Support LDPC with RAID ECC. GUI management tool & software API package. High Endurance sTLC Product Selection.
SQF M.2 2280 SSD 650 256G 3D BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5 SATA SSD 830 64G UMLC (0~70°C) [ES] Compliant with SATA III and SATA v3.2 standard. Supports 120 bit ECC correct per 2K Byte data. Supports Fragment Writing and Flush Manager. Optional support for AES and voltage stabilizer. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
SQF M.2 2280 SSD 660 64G 3D BiCS5 (-20~75°C) SATA 3.2 Compliant. Supports LDCP & RAID ECC. SMART, SQLog & SQAnalyzer for diagnosis. GUI management tool & software API package. -20 to +75 °C operation temperature, and can withstand peak up to -40℃ or 85℃ for 1hr.
SQF 2.5" SSD 650 256G 3D BiCS5 (-40~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
EMIO 1-Ch, GigaLAN module, Full-size 1-Ch PCIe to GigaLAN ethernet module. Support full duplex operation at 10/100/1000 Mb/s. Full size MiniPCIe type. Compliant with PCI Express TM 2.1. Compliant with 1Gb/s IEEE 802.3, 802.3u, 802.3ab. Wide temperature from -40 to +85 degree.
SQF mSATA SSD 660 256G 3D BiCS5 (-20~75°C) SATA 3.2 Compliant. MO-300 mSATA Module. Supports LDCP & RAID ECC. SMART, SQLog & SQAnalyzer for diagnosis. GUI management tool & software API package. -20 to +75 °C operation temperature, and can withstand peak up to -40℃ or 85℃ for 1hr.
SODIMM DDR4 3200 16GB (0-85) SAM-G Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SQF 2.5" SSD 840-D 480G 3D sTLC BiCS5 (-40~85°C) Compliant with SATA III and SATA v3.2 standard. Support AES256 and TCG-OPAL Compliant. Support HW Write Protection. Support LDPC with RAID ECC. GUI management tool & software API package. High Endurance sTLC Product Selection.
SQF 2.5" SSD 840 480G BiCS 3 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Support AES256 and TCG-OPAL Compliant. Support HW Write Protection. Support LDPC with RAID ECC. GUI management tool & software API package. High Endurance sTLC Product Selection.
SQF 2.5" SSD 650 512G 3D sTLC BiCS5 (-40~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
UDIMM DDR4 3200 16GB 1024x8 (0-85) Micron 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16/32GB. Operating Temperature: 0°C ~ 85°C. Fixed BOM / Lifetime warranty.
SQF M.2 2280 920-D 480G 3D TLC BiCS5 (-40~85℃) NGFF M.2 2280 SSD (M key). Compliant with PCIe Gen. III x4 interface and NVMe 1.3. Support LDPC with RAID ECC. TRIM、AHCI supported. GUI management tool & software API package.
SQF CFast 640 64G MLC (-40~85°C) Compliant with standard CFast card Type 1 specifications. Interface: SATA Gen. 3. Supports LDPC & RAID ECC. Universal wear-leveling and bad block management. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
RDIMM DDR5 6400 64GB 4Gx4 (0-95) Hynix Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.
SQF mSATA SSD 650 256G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5 SATA SSD 830 512G MLC (0~70°C) Compliant with SATA III and SATA v3.2 standard. Supports 120 bit ECC correct per 2K Byte data. Supports Fragment Writing and Flush Manager. Optional support for AES and voltage stabilizer. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
ECC UDIMM DDR4 3200 32GB (0-85) SAM-C Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
UDIMM DDR4 3200 4GB 512Gx16 (0-85) Micron 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16/32GB. Operating Temperature: 0°C ~ 85°C. Fixed BOM / Lifetime warranty.
SQC CANBus Full-size, 2-Ch, USB I/F USB to 2x CANBus port module with isolated. Full size Mini PCIe & Module type combo. Combo USB (Internal/ External) Interface. Compliant with CAN 2.0A and CAN 2.0B identifiers, According to ISO 11898-1 and ISO 11898-2. Bit rates up to 1 Mbit/s.
EMIO High-Speed COM,Full-size,USB I/F Full size Mini PCIe & Module type combo. USB to 1 port High Speed Serial COM port with 4K V peak Isolation. RS232 up to 1Mbps, RS422/RS485 up to 10Mbps, FIFO buffer is 1K byte transfer/ receive. Widely temperature from -40 ~ 85 degree.
SQF 2.5" SSD 650 512G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SODIMM ECC DDR4 3200 32GB 2Gx8 (0-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SQF M.2 2280 930 1920G 3D TLC BiCS5 (0~70°C) NGFF M.2 2280 SSD (M key). Compliant with PCIe Gen.4 x4 interface and NVMe 1.4. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Heat-spreading design with thermal solution. SMART and GUI management tool.
SQF M.2 2280 640-C 64G 3D sTLC BiCS4 (- NGFF M.2 2280 SSD Module. Compliant with SATA III and SATA v3.2 standard. Supports LDPC of ECC correct. Preserved pin on M.2 connector for Voltage Stabilizer support from main board. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management...
UDIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SQF U.2 SSD ER-1 800G 3D TLC BiCS5 (-40~85℃) U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution. SMART and GUI management tool.
SQF U.2 SSD ER-1 3.2T 3D TLC BiCS5 (-40~85℃) U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution. SMART and GUI management tool.
SQF U.2 SSD ER-1 3.2T 3D TLC BiCS5 (0~70℃) U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution. SMART and GUI management tool.
SQF M.2 2280 SSD 650 128G 3D BiCS5 (-20~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF 2.5" SSD 640 32G 3D TLC (0~70°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC of ECC correct. Compliant with SATA III and SATA v3.2 standard.
SODIMM DDR5 5600 8GB 1Gx16 (0-95) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM ECC DDR4 3200 32GB 2Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SQF U.2 SSD ER-1 800G 3D TLC BiCS5 (0~70℃) U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution. SMART and GUI management tool.
SQF M.2 2280 920 240G 3D TLC BiCS3 (-40~85℃) NGFF M.2 2280 SSD (M key). Compliant with PCIe Gen. III x4 interface and NVMe 1.3. Support LDPC with RAID ECC. TRIM、AHCI supported. GUI management tool & software API package.
SQF 2.5" SSD 640 128G UMLC (0~70°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
UDIMM ECC DDR4 3200 8GB 1Gx8 (0-85) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty. ECC function support. 30μ" PCB Golden Finger.
ECC SODIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity :16GB/32GB. Original Samsung/Micron IC adopted. ECC function support. Independent Power Management IC build-in. Operation Temperature: 0°C ~ 95°C.
SODIMM DDR5 4800 16GB 2Gx8 (0-95) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SQF M.2 2280 ER-1 1.6T 3D TLC BiCS5 (-40~85℃) NGFF M.2 2280 SSD (M key). Compliant with PCIe Gen. 4 x4 interface and NVMe 1.4. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution. SMART and GUI management tool.
SQF M.2 2280 720-D 512G 3D TLC BiCS5 (-20~85℃) NGFF M.2 2280 SSD (B & M key). Compliant with PCIe Gen. III x2 interface and NVMe 1.3. Support LDPC with RAID ECC. TRIM supported. GUI management tool & software API package.
SQF U.2 920-D 960G 3D TLC BiCS5 (-40~85°C) GUI management tool & software API package. TRIM、AHCI supported. U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Support LDPC with RAID ECC. Compliant with PCIe Gen.3 x4 interface and NVMe 1.3.
SQF 2.5" SSD 840-C 240G 3D sTLC BiCS4 (0 GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Optional support for voltage stabilizer. Support AES256 and Quick Erase. Supports Fragment Writing and Flush Manager. Support LDPC with RAID ECC. Compliant with SATA III and SATA v3.2 standard.
EMIO Parallel module,Full-size,USB I/F USB to 1x Parallel port module. Full size Mini PCIe & Module type combo. MiniPCIe thru USB & USB Pin Header. Support IEEE 1284-compliant ECP.
SQF M.2 2242 SATA SSD 640 128GB BiCS 3( GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC of ECC correct. Compliant with SATA III and SATA v3.2 standard. NGFF M.2 2242 SSD Module.
SODIMM ECC DDR4 3200 16GB 1Gx8 (-40-85) Micron 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.
SODIMM DDR5 5600 8GB 1Gx16 (-40-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung/Hynix IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
SQF 2.5" SSD 640 256G 3D TLC (-40~85°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC of ECC correct. Compliant with SATA III and SATA v3.2 standard.
ECC SODIMM DDR5 5600 16GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity :16GB/32GB. Original Samsung/Micron IC adopted. ECC function support. Independent Power Management IC build-in. Operation Temperature: 0°C ~ 95°C.
ECC UDIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 5600/4800 MT/s. Capacity : 16GB/32GB. Original:Samsung/Micron IC adopted. Independent Power Management IC build-in. ECC function support. Operating Temperature: 0°C ~ 85°C.
SQF M.2 2280 SSD 650 256G 3D sTLC BiCS5 (-40~85° SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SODIMM DDR4 3200 4GB 512x16 (-40-85) SAM 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. Fixed BOM & lifetime warranty. DRAM Software Monitoring.
SQF U.2 SSD ER-1 1.6T 3D TLC BiCS5 (-40~85℃) U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution. SMART and GUI management tool.
SQF M.2 2230 720-D 256G 3D TLC BiCS5 (-40~85°C) NGFF M.2 2230 SSD (A & E key). Compliant with PCIe Gen. III x2 interface and NVMe 1.3. Support LDPC with RAID ECC. TRIM supported. GUI management tool & software API package.
SQF 2.5" SSD 650 1T 3D BiCS5 (-40~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF M.2 2280 SSD 840-D 960G 3D BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. GUI management tool & software API package. Shock resistance and anti-vibration.
SQF mSATA SSD 640 128G BiCS3 (-40~85°C) MO-300 mSATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.
SQF 2.5" SSD 640 32G MLC (-40~85°C) GUI management tool & software API package. Shock resistance, anti-vibration and low power consumption. Supports Fragment Writing Technology and Flush Manager. Supports LDPC and RAID ECC. Compliant with SATA III and SATA v3.2 standard.
SQF mSATA SSD 660 512G 3D BiCS5 (-20~75°C) SATA 3.2 Compliant. MO-300 mSATA Module. Supports LDCP & RAID ECC. SMART, SQLog & SQAnalyzer for diagnosis. GUI management tool & software API package. -20 to +75 °C operation temperature, and can withstand peak up to -40℃ or 85℃ for 1hr.
SQF M.2 2280 SSD 660BR 256G 3D BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Supports Hardware GPIO and Software Triggering. Logical Block Recovery. Supports LDCP & RAID ECC. GUI management tool & software API package.
SQF M.2 2280 SSD 660BR 128G 3D BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. Supports Hardware GPIO and Software Triggering. Logical Block Recovery. Supports LDCP & RAID ECC. GUI management tool & software API package.
SQF M.2 2280 930L 480G 3D TLC BiCS5 (0~70°C) Compliant with PCIe Gen.4 x4 interface and NVMe 1.4. 5Y DWPD >1 High Endurance. Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. SMART and GUI management tool.
SQF M.2 2280 SSD 650 128G 3D sTLC BiCS5 (-40~85° SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.
SQF U.2 SSD ER-1 400G 3D TLC BiCS5 (-40~85℃) U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution. SMART and GUI management tool.
SQF M.2 2280 ER-1 800G 3D TLC BiCS5 (-40~85℃) NGFF M.2 2280 SSD (M key). Compliant with PCIe Gen. 4 x4 interface and NVMe 1.4. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution. SMART and GUI management tool.
