AIW 300 Series (LTE/4G/5G)

5G NR FR1 module, M.2 3052 Key B, USB only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...

4G LTE Cat4. + GNSS module with mPCIe form factor, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module, with GPS, for EU, for TW, for...

4G LTE Cat4. + GNSS modem card, with M.2 3052 form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...

4G LTE Cat4. + GNSS modem card, with mini-PCIe form factor, with Sim slot, for US Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE Cat 4 and FDD-LTE/WCDMA, with GPS. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operating temperature: Normal: : -30°C ~ +85°C/Extended: -40°C ~...

4G LTE Cat4. + GNSS module with mPCIe form factor, with Sim slot, EU version Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE CAT4 , WCDMA/GSM/GPRS/EDGE. LTE: 150Mbps DL/50Mbps UL (Cat 4). Operating temperature: Normal: : -20°C ~ +55°C/Extended: -40°C ~ +85°C. With GPS. With SIM slot.

4G LTE Cat4. + GNSS module with mPCIe form factor, for EU, for TW, for Australia, for Brazil Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module,...

5G NR FR1 module, M.2 3052 Key B, PCIe only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...

5G NR FR1 module, USB communication interface, with GNSS, for EU, for Australia Main Chipset Qualcomm SDX62. Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). AIW-356...

5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .

5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .

5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .