4G LTE Cat4. + GNSS module with mPCIe form factor, for EU, for TW, for Australia, for Brazil Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. LTE FDD:150Mbps DL/50Mbps UL (Cat 4). LTE TDD:130Mbps DL/30.5Mbps UL (Cat 4). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C. AIW-344FQ-E02 LTE/HSPA+/GPRS module,...
AIW-3 series LTE CAT4 mini PCIe module f Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. PCI Express mini-card/USB 2.0. Data throughput :4G/LTE Cat. 4 (FDD-LTE: 150 Mbps DL, 50 Mbps UL; TDD-LTE: 130 Mbps DL, 30 Mbps UL). Operation: Normal: -30°C ~ +75°C/Extended: -40°C ~ +85°C.
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
5G NR FR1 module, M.2 3052 Key B, USB only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...
5G(Sub-6G)/LTE/WCDMA module, with GNSS, for Europe Main Chipset Qualcomm SDX62. Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). AIW-356 DQ-N01: 5G(Sub-6G)/LTE/WCDMA...
4G LTE Cat4. + GNSS module with mPCIe form factor, with Sim slot, EU version Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 4G/LTE CAT4 , WCDMA/GSM/GPRS/EDGE. LTE: 150Mbps DL/50Mbps UL (Cat 4). Operating temperature: Normal: : -20°C ~ +55°C/Extended: -40°C ~ +85°C. With GPS. With SIM slot.
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
4G LTE Cat4 modem (US) with mPCIe form factor Pre-carrier-certified 4G LTE Cat4. modem. Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 2 types adapter boards/USB 2.0 bus: PCI Express mini-card and M.2 3052. Data throughput :4G/LTE Cat. 4 (FDD-LTE: 150 Mbps DL, 50 Mbps UL; TDD-LTE: 130 Mbps DL, 30 Mbps UL)....
4G LTE Cat4 modem (US) with M.2 3052 form factor Pre-carrier-certified 4G LTE Cat4. modem. Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 2 types adapter boards/USB 2.0 bus: PCI Express mini-card and M.2 3052. Data throughput :4G/LTE Cat. 4 (FDD-LTE: 150 Mbps DL, 50 Mbps UL; TDD-LTE: 130 Mbps DL, 30 Mbps UL)....
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
5G NR FR1 module, M.2 3052 Key B, PCIe only sku Main Chipset MediaTek T700. Max UL peak rate of 1150Mbps. Max DL peak rate 2.97 Gbps NSA EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB/ PCIe two sku interface. Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F). AIW-357 DK-G1P: 5G NR FR1 module,...
