4G LTE Cat4 modem (US) with mPCIe form factor Pre-carrier-certified 4G LTE Cat4. modem. Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 2 types adapter boards/USB 2.0 bus: PCI Express mini-card and M.2 3052. Data throughput :4G/LTE Cat. 4 (FDD-LTE: 150 Mbps DL, 50 Mbps UL; TDD-LTE: 130 Mbps DL, 30 Mbps UL)....
4G LTE Cat4 modem (US) with M.2 3052 form factor Pre-carrier-certified 4G LTE Cat4. modem. Main Chipset Qualcomm MDM9X07. 2 LTE Antenna Coaxial Connectors +1 GPS antenna connector. 2 types adapter boards/USB 2.0 bus: PCI Express mini-card and M.2 3052. Data throughput :4G/LTE Cat. 4 (FDD-LTE: 150 Mbps DL, 50 Mbps UL; TDD-LTE: 130 Mbps DL, 30 Mbps UL)....
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
5G(Sub-6G)/LTE/WCDMA module, GNSS, for Main Chipset Qualcomm SDX55. Max UL peak rate of 525Mbps. Max DL peak rate 4.1 Gbps DL 4 x 4 NR Sub6 EN-DC. UL Max support 2 MIMO, DL Max support 4 MIMO. M.2 3052 form factor, USB interface. Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F). .
