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Advantech
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Connections
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Cellular Routers and Gateways
- Accessories
- Antennas
- Dual Module 4G Routers
- EN 50155 Railway 4G Routers
- Entry Level 4G Routers
- Entry Level 4G Routers & IoT Gateways
- Flexible 4G Routers & IoT Gateways
- High Speed 4G/5G Routers & Edge Computing Gateways
- Modular 3G Routers
- Modular 4G Routers
- Power supplies
- Robust 4G Routers & IoT Gateways
- Software
- Wired LAN Routers
- Ethernet / Serial Device Servers
- Fiber & PoE Converters, Injectors, Extenders
- Industrial Ethernet Switches
- Industrial Protocol Gateways
- Industrial Wireless and Gateways
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Serial Communication
- Serial Communication Cards
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Serial Converters/Isolators/Repeaters - ULI-200
- Data Tap/Splitter/Port Combiner - ULI-250/260
- RS-232 Isolated Repeater/Isolator - ULI-232 Series
- RS-232 to RS-422 Converters - ULI-223 Series
- RS-232 to RS-422/485 Converters - ULI-224 Series
- RS-232 to RS-485 Converters - ULI-226 Series
- RS-232/422 to TTL/Current Loop Converter - ULI-227
- RS-422/485 Isolated Repeaters - ULI-234 Series
- Serial Surge Suppressors - ULI-240 Series
- Serial to Fiber Converters - ULI-210 Series
- USB Converters/Isolators/Hubs - ULI-300/400
- Telematics Converters and Gateways
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Cellular Routers and Gateways
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Industrial automation
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Industrial Automation
- Automation Controllers & I/O
- Certified Solutions
- Class I, Division 2 Solution
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Data Acquisition (DAQ)
- 3U Communication Boards (MIC-3600 Series)
- 3U Data Acquisition and Control Boards (MIC-3700 Series)
- DAQ Cards
- DAQ-embedded Computer/Module
- DAQNavi
- GPIB
- iDoor Module(Mini PCIe)
- ISA DAQ Cards
- Modular DAQ System
- PC-104/PCI-104 DAQ & Communication Cards
- Signal Conditioning Modules and Terminal Boards
- USB Modules
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Embedded Automation Computers
- Advantech iDoor Module
- Compact Embedded Box IPC
- Compact Embedded Box PC
- Din-Rail Automation Computer, UNO-1 Series
- Din-Rail Control IPC
- Expandable Automation Computer
- Expandable Automation Computer, UNO-3 Series
- Explosion-Proof Computer
- Industrial IoT Edge Gateway
- Rackmountable Automation Computers for Power Substations
- Standmount Embedded Box PC, UNO-2 Series
- UNO Accessories
- Gateways & Remote Terminal Units (RTUs)
- Human Machine Interfaces
- Machine Automation
- Panel PC
- Power & Energy
- Remote I/O
- SoftLogic Software
- Software Development Kits
- WebAccess Software & Edge SRP
- Wireless I/O & Sensors
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Industrial Automation
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Embedded computing
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Embedded Computing
- AIoT Software, Distribution & Services
- Arm-Based Computing Platforms
- Cable Accessories
- Computer On Modules
- Digital Signage Players
- Edge AI & Intelligence Solutions
- Embedded PCs
- Embedded Single Board Computers
- Embedded Software
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Fanless Embedded Computers
- ARK Ultra Rugged Series
- ARK-1000 Series: Ultra Slim Fanless Embedded Computers
- ARK-2000 series : Easy I/O Flexibility Fanless Embedded Computers
- ARK-3000 Series: High Performance Fanless Embedded Computers
- ARK-6300 Series: Mini-ITX Series Fanless Embedded Computers
- ARK-7000 Series: Extreme Performance Edge Servers
- iDoor Module Mini PCIe Expansion Kit
- Storage Modules
- Gaming Platform Solutions
- Industrial Display Systems
- Industrial Flash & Memory Solutions
- Industrial Motherboards
- Industrial Wireless Solutions
- Wireless ePaper Display Solutions
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Embedded Computing
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Westermo
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Ethernet Extenders
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Industrial routers
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Wireless & Cellular
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Modems
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Accessories
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Korenix
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Ethernet switches
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Media convertors
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Industrial connectivity
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Wireless data transfer
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Elproma
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Elproma
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DDR3 Memory
8G DDR3-1600 512X8 1.35V 1.5V SAM DDR3 1600Mhz Unbuffered DIMM. 30μ" gold plating thickness. 1.35V power consumption. Samsung original chip.
8G DDR3-1600 512X8 1.35V&1.5V SAM(G) DDR3-1600. 240-Pin. 512MX8. Samsung Chip.
4G DDR3-1600 512X8 1.35V & 1.5V SAM DDR3 1600Mhz Unbuffered DIMM. 30μ" gold plating thickness. 1.35V power consumption. Samsung original chip.
8GB ECC-DDR3-1600 1.35V&1.5V 512X8 SAM DDR3-1600 ECC. 240-Pin. 512MX8. Samsung Chip.
2G DDR3-1600 256X8 1.35V&1.5V SAM DDR3 1600Mhz Unbuffered DIMM. 30μ" gold plating thickness . 1.35V power consumption. Samsung original chip.
8G R-DDR3-1600 1.35V&1.5V 512X8 SAM DDR3-1600 ECC Registered. 240-Pin. 512MX8. Samsung Chip.
8G SO-DDR3-1600 512X8 1.35V SAM -40~85℃ 30u" Gold Plating Thickness. Anti-sulfurization resistance. Samsung original chip. Wide Temp. -40C to +85C. 100% tested for stability, compatibility and performance.
- On enquiry
4G SO-DDR3-1600 512X8 1.35V SAM -40~85℃ 30u" Gold Plating Thickness. Anti-sulfurization resistance. Samsung original chip. Wide Temp. -40C to +85C. 100% tested for stability, compatibility and performance.
- On enquiry
8G DDR3-1600 512X8 1.35V HYX DDR3-1600. 240-Pin. 512MX8. Hynix Chip.
- On enquiry
2G ECC DDR3-1600 256X8 1.35V SAM DDR3-1600 ECC. 240-Pin. 256MX8. Samsung Chip.
- On enquiry
4GB ECC-DDR3-1600 1.35V&1.5V 512X8 SAM DDR3-1600 ECC. 240-Pin. 512MX8. Samsung Chip.
- On enquiry
4G DDR3-1600 512X8 1.35V HYX DDR3-1600. 240-Pin. 512MX8. Hynix Chip.
- On enquiry
(DEL21)4G DDR3-1600 512X8 1.35V MIC DDR3-1600. 240-Pin. 512MX8. Micron Chip.
- On enquiry
4G R-DDR3-1600 1.35V 512X8 SAM DDR3-1600 ECC Registered. 240-Pin. 512MX8. Samsung Chip.
- On enquiry