ECC UDIMM DDR4 3200 16GB (0-85) SAM-G Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
SODIMM ECC DDR4 3200 32GB 2Gx8 (0-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
ECC UDIMM DDR4 3200 32GB (0-85) SAM-C Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
SODIMM ECC DDR4 3200 32GB 2Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
ECC UDIMM DDR4 3200 8GB (0-85) SAM-G Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
SODIMM ECC DDR4 3200 8GB 1Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SODIMM ECC DDR4 3200 16GB 1Gx8 (0-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SODIMM ECC DDR4 3200 16GB 1Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SODIMM ECC DDR4 3200 8GB 1Gx8 (0-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
ECC UDIMM DDR4 2666 4GB 512x8 (0-85) Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
260pin ECC SODIMM-D4-2666 32G SAM 2Gbx8, 0-85 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
ECC SODIMM DDR4 2666 8GB 1GX8 (0-85) 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
ECC SODIMM DDR4 2666 8GB 1Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
ECC SODIMM DDR4 2666 16GB 1Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SODIMM(ECC) DDR4 2133 16GB (-40-85) 260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix) . ECC function support. Wide temperature range support -40oC~85oC.
ECC SO D4 2400 16GB (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix) . ECC function support. Wide temperature range support -40oC~85oC.
SODIMM(ECC) DDR4 2400 16GB 1G*8 (0-85) 260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix) . ECC function support. Wide temperature range support -40oC~85oC.
UDIMM(ECC) DDR4 2400 16GB 1G*8 (0-85) S Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
260pin ECC SO-D4-2666 32G 2Gbx8, -40-85 260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix) . ECC function support. Wide temperature range support -40oC~85oC.
