SODIMM DDR3L 1600 4GB I-Grade (-40-85)
30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SODIMM DDR3L 1600 4GB Mi-Grade (-20-85)
Tier one original Samsung chip adopted. Data transfer rate: 1600MT/s. 3yrs longevity & lifetime warranty. Operating Temperature: -20 °C ~ 85 °C. Free Intelligent software monitor DRAM real time information. .
SODIMM(ECC) DDR4 2133 16GB (-40-85)
260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s
Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix)
. ECC function support. Wide temperature range support -40oC~85oC.
ECC SO D4 2400 16GB (-40-85) SAM
260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s
Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix)
. ECC function support. Wide temperature range support -40oC~85oC.
SODIMM(ECC) DDR4 2400 16GB 1G*8 (0-85)
260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s
Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix)
. ECC function support. Wide temperature range support -40oC~85oC.
Rugged SODIMM DDR4 2666 16GB Hynix 1Gx8, 0-85C
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s. Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C. Original IC chip (Samsung/Hynix).
SQRAM 2G SO-DDR3-1333 I-GRD SAM
30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SODIMM DDR3L 1333 2GB 256x8 SAM-F(-40-8
30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SODIMM DDR3L 1600 2GB I-Grade(-40-85)
30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SODIMM DDR3L 1600 2GB Mi-Grade (-20-85)
Tier one original Samsung chip adopted. Data transfer rate: 1600MT/s. 3yrs longevity & lifetime warranty. Operating Temperature: -20 °C ~ 85 °C. Free Intelligent software monitor DRAM real time information. .
SODIMM DDR3L 1600 4GB SAM 512X8 (0-85)
Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C/ wide temperature -40 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
SODIMM DDR3L 1600 2GB 256x8(0-85
Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C/ wide temperature -40 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
SODIMM DDR3L 1866 2GB Micron 256x16 0-85
Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C/ wide temperature -40 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
SODIMM DDR3L 1600 4GB Micron 512X8 (0-85)
Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C/ wide temperature -40 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
SODIMM DDR3L 1866 4GB Micron 256x16 0-85
Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C/ wide temperature -40 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
260pin ECC SO-D4-2666 32G 2Gbx8, -40-85
260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s
Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix)
. ECC function support. Wide temperature range support -40oC~85oC.
SODIMM DDR4 2666 4GB 512x16 (0-85) SAM
Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.