SODIMM DDR3L 1600 4GB I-Grade (-40-85) 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SODIMM DDR4 2666 8GB 1Gbx8 (0-85C) Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR3L 1600 8GB Mi-Grade (-20-85) Tier one original Samsung chip adopted. Data transfer rate: 1600MT/s. 3yrs longevity & lifetime warranty. Operating Temperature: -20 °C ~ 85 °C. Free Intelligent software monitor DRAM real time information. .
SODIMM DDR3L 1600 8GB I-Grade (-40-85) 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
UDIMM DDR5 4800 16GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800 MT/s. Capacity : 16GB/32GB. Original Micron/Samsung IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 85°C.
UDIMM DDR5 4800 16GB 2Gx8 (0-85) Micron Data Transfer Rate: 4800 MT/s. Capacity : 16GB/32GB. Original Micron/Samsung IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 85°C.
SODIMM DDR5 4800 16GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800 MT/s. Capacity : 16GB/32GB. Original Micron/Samsung IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 85°C.
SODIMM DDR5 4800 16GB 2Gx8 (0-85) Micron Data Transfer Rate: 4800 MT/s. Capacity : 16GB/32GB. Original Micron/Samsung IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 85°C.
SODIMM DDR4 2666 16GB 1Gbx8 (0-85C) Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR4 2666 4GB 512Mx8 (-20-85C) Original IC chip adopted. 30u” Golden Finger. Extended Temperature: -20C~85C. Monitor DRAM software tool support. Lifetime Warranty.
SODIMM DDR3L 1866 4GB Micron 256x16 0-85 Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C/ wide temperature -40 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
ECC SODIMM DDR4 2666 8GB 1Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
Rugged ECC SODIMM DDR4 2666 32GB SAM 2Gx8 , -40-85C Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s. Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C. Original IC chip (Samsung/Hynix).
UDIMM DDR5 4800 32GB 2Gx8 (0-85) Micron Data Transfer Rate: 4800 MT/s. Capacity : 16GB/32GB. Original Micron/Samsung IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 85°C.
SODIMM DDR5 4800 32GB 2Gx8 (0-85) Micron Data Transfer Rate: 4800 MT/s. Capacity : 16GB/32GB. Original Micron/Samsung IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 85°C.
SODIMM DDR5 4800 32GB 2Gx8 (-40-85) Sams Data Transfer Rate: 4800 MT/s. Capacity : 8GB/16GB/32GB. Original Micron/Samsung IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 85°C.
SODIMM DDR4 3200 8GB 1Gx8 (0-85) Micron Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR4 3200 4GB 512x16 (0-85) SAM Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR4 3200 4GB 512x16 (0-85) Micro Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR4 3200 32GB 2Gx8 (0-85) Micron Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR4 3200 16GB 2Gx8 (0-85) Micron Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
204pin SODIMM DDR3L 1600 2GB 256x8(-40-8 Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
RDIMM D4 3200 16GB (0-85) SAM-C 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
UDIMM DDR4 2666 8GB 512x8 (0-85) SAM 288-pin Dual In-Line Memory Module. Data Transfer Rate: 2400/2666/3200 MT/s. Capacity: 2GB/4GB/8GB/16GB. Operating Temperature: 0°C ~ 85°C. Fixed BOM / Lifetime warranty.
UDIMM DDR4 2666 4GB 512x16 (0-85) SAM Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
MEMORY MODULE, 240pin UDIMM ECC D3 1600 8G 512x8 SAM E DIE Original memory chips (Samsun/Hynix). ECC function support. Fixed BOM . Wide Temperature support (-40~85oc). .
SODIMM DDR4 3200 8GB 1Gx16 (0-85) Micron Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
ECC SODIMM DDR4 2666 8GB 1GX8 (0-85) 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
260pin SODIMM-D4-2666 8G 1Gbx8 HYNX 0-85 Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR4 3200 4GB 512x8 (0-85) SAM-F Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666/2400 MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR4 2666 4GB 512x16 (-40-85) SAM 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. Fixed BOM & lifetime warranty. DRAM Software Monitoring . .
ECC SODIMM DDR4 2666 16GB 1Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SODIMM DDR3L 1600 8GB 512x8(0-85°C) Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
SODIMM DDR3L 1600 8GB 512x8(0-85°C) Original Samsung/Micron IC chips adapted. Data transfer rate: 1600MHz. Operating Temperature: 0 °C ~ 85 °C. 30u” golden finger and Fixed BOM. Free Intelligent software monitor DRAM real time information.
SQRAM 4G SO-DDR3-1600 (-20~85) LOW VOL Tier one original Samsung chip adopted. Data transfer rate: 1600MT/s. 3yrs longevity & lifetime warranty. Operating Temperature: -20 °C ~ 85 °C. Free Intelligent software monitor DRAM real time information. .
SQRAM 8G SO-DDR3-1600 LOW VOLTAGE I-GRD 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SODIMM DDR3L 1866 4GB (-40-85) Tier one original Samsung chip adopted. Data transfer rate: 1600MT/s. 3yrs longevity & lifetime warranty. Operating Temperature: -20 °C ~ 85 °C. Free Intelligent software monitor DRAM real time information. .
SODIMM DDR3L 1600 4GB Micron 512X8 (-40 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SODIMM DDR3L 1600 4GB 256X16, ISSI-C(-40 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SQRAM 4G SO-DDR3-1600 LOW VOLTAGE I-GRD 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SQRAM 4G SO-DDR3-1333 I-GRD SAM 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SQRAM 2G SO-DDR3-1600 LOW VOLTAGE I-GRD 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
RDIMM D4 3200 8GB (0-85) SAM-C 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
RDIMM D4 2666 8GB (0-85) SAM-C 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
RDIMM DDR4 2666 4GB w/ECC 512x8 SAM 0-85 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
RDIMM D4-3200 32GB HYNIX 2Gx4, 0-85 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
RDIMM D4 3200 32GB (0-85) SAM 2Gbx4 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
SODIMM(ECC) DDR4 2133 16GB (-40-85) 260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix) . ECC function support. Wide temperature range support -40oC~85oC.
ECC SO D4 2400 16GB (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix) . ECC function support. Wide temperature range support -40oC~85oC.
SODIMM(ECC) DDR4 2400 16GB 1G*8 (0-85) 260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix) . ECC function support. Wide temperature range support -40oC~85oC.
