260pin ECC SO-D4-2666 32G 2Gbx8, -40-85 260pin SODIMM ECC DIMM. Data transfer rate: 2133/2400/2666 MT/s Capacity: 2GB~16GB. Original IC chip (Samsung/Hynix) . ECC function support. Wide temperature range support -40oC~85oC.
SODIMM DDR5 5600 8GB 1Gx16 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
204pin SODIMM DDR3L 1600 8GB 512x8(-40-85) Micro 30u” golden finger. Operating Temperature: -40° C to +85° C. 100% Screening Test. Original chip vendor adopted. EEPROM with Thermal sensor. Burn-In Test.
SODIMM D4 3200 16GB (0-85) 2Gx8 Hynix Original Hynix IC chips adopted. Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. Lifetime warranty.
UDIMM DDR4 3200 8GB 1Gx8 (0-85C) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16GB/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty.
SODIMM DDR3L 1866 4GB (-40-85) Tier one original Samsung chip adopted. Data transfer rate: 1600MT/s. 3yrs longevity & lifetime warranty. Operating Temperature: -20 °C ~ 85 °C. Free Intelligent software monitor DRAM real time information. .
SODIMM DDR5 5600 16GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR4 3200 8GB 1Gx8 (-40-85) Micron 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.
SODIMM DDR5 5600 32GB 2Gx8 (0-95) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR5 5600 16GB 2Gx8 Samsung(-40~95) Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
SODIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR5 4800 16GB 2Gx8 (0-95) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
UDIMM ECC DDR4 3200 8GB 1Gx8 (0-85) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty. ECC function support. 30μ" PCB Golden Finger.
UDIMM DDR4 3200 4GB 512Gx16 (0-85) Micron 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16/32GB. Operating Temperature: 0°C ~ 85°C. Fixed BOM / Lifetime warranty.
SODIMM DDR4 3200 16GB (0-85) SAM-G Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR5 5600 16GB 2Gx8 (-40-85) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung/Hynix IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
ECC UDIMM DDR4 3200 32GB (0-85) SAM-C Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
SODIMM ECC DDR4 3200 32GB 2Gx8 (0-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SODIMM ECC DDR4 3200 32GB 2Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
ECC UDIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 5600/4800 MT/s. Capacity : 16GB/32GB. Original:Samsung/Micron IC adopted. Independent Power Management IC build-in. ECC function support. Operating Temperature: 0°C ~ 85°C.
SODIMM ECC DDR4 3200 8GB 1Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SODIMM DDR5 5600 16GB 2Gx8 (0-95) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR4 2666 8GB 1Gbx8 (-20-85C) Original IC chip adopted. 30u” Golden Finger. Extended Temperature: -20C~85C. Monitor DRAM software tool support. Lifetime Warranty.
RDIMM DDR5 4800 16GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.
RDIMM D4 2666 8GB (0-85) SAM-C 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
ECC SODIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity :16GB/32GB. Original Samsung/Micron IC adopted. ECC function support. Independent Power Management IC build-in. Operation Temperature: 0°C ~ 95°C.
RDIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.
RDIMM D4 3200 64GB (0-85) SAM 4Gx4 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
UDIMM DDR5 5600 16GB 2Gx8 Hynix Data Transfer Rate: 5600 MT/s. Capacity : 8/16/24/32/48 GB. Original Samsung/Hynix/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
DDR5 CXL 2.0 E3.S-2T Type3 PCIE5.0 64GB EDSFF E3.S 2T form-factor. Data Transfer Rate: PCIe Gen 5.0x8 32GT/s. Capacity : 64GB. Operating Temperature: 0°C ~ 70°C. 30μ’’ PCB gold finger. Independent Power Management IC build-in. Support ECC error detection and correction. Register Clock Driver(RCD) for stable performance. Hot Swap Function Support.
RDIMM DDR5 5600 64GB 4Gx4 Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.
SODIMM ECC DDR4 3200 8GB 1Gx8 (0-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SODIMM DDR4 2666 32GB 2Gbx8 (0-85C) Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR5 4800 32GB 2Gx8 (0-95) Hynix Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 8/16/24/32/48/64GB. Original Samsung/Hynix/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
260pin SODIMM-D4-2666 8G 1Gbx8 HYNX 0-85 Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
SODIMM DDR4 2666 8GB 1Gbx8 (-40-85C) 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. Fixed BOM & lifetime warranty. DRAM Software Monitoring.
SODIMM DDR4 3200 8GB 1Gbx8 (0-85C) Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
UDIMM DDR4 3200 4GB 512x16 (0-85) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16GB/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty.
UDIMM DDR4 3200 32GB 2Gx8 (0-85C) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16GB/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty.
UDIMM DDR4 3200 16GB 1Gx8 (0-85C) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16GB/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty.
UDIMM ECC DDR4 3200 32GB 2Gx8 (0-85) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty. ECC function support. 30μ" PCB Golden Finger.
UDIMM ECC DDR4 3200 16GB 1Gx8 (0-85) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty. ECC function support. 30μ" PCB Golden Finger.
ECC SODIMM DDR5 5600 16GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity :16GB/32GB. Original Samsung/Micron IC adopted. ECC function support. Independent Power Management IC build-in. Operation Temperature: 0°C ~ 95°C.
SODIMM DDR5 5600 32GB 2Gx8 (-40-85) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung/Hynix IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
SODIMM DDR5 5600 8GB 1Gx16 (-40-85) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung/Hynix IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
SODIMM D4 3200 8GB (0-85) 1Gx8 Hynix Original Hynix IC chips adopted. Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. Lifetime warranty.
SODIMM DDR4 3200 4GB 512x16 (0-85) Hynix Original Hynix IC chips adopted. Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. Lifetime warranty.
SODIMM D4 3200 32GB (0-85) 2Gx8 Hynix Original Hynix IC chips adopted. Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. Lifetime warranty.
SODIMM ECC DDR4 3200 8GB 1Gx8 (0-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.
SODIMM ECC DDR4 3200 16GB 1Gx8 (0-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.
SODIMM ECC DDR4 3200 32GB 2Gx8 (0-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.
SODIMM DDR4 3200 8GB (-40-85)Hynix 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.
SODIMM ECC DDR4 3200 8GB 1Gx8 (-40-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.
SODIMM DDR4 3200 32GB 2Gx8 (-40-85) Micron 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.
SODIMM DDR4 3200 4GB 512x16 (-40-85) Hynix 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.
SODIMM DDR4 3200 32GB (-40-85)Hynix 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.
SODIMM DDR4 3200 16GB 1Gx8 (-40-85) Micron 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.
SODIMM ECC DDR4 3200 32GB 2Gx8 (-40-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.
SODIMM ECC DDR4 3200 16GB 1Gx8 (-40-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.
SODIMM DDR4 3200 16GB (-40-85)Hynix 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.
RDIMM DDR5 5600 32GB 2Gx8 Hynix Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.
RDIMM DDR5 5600 16GB 2Gx8 Samsung Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.
RDIMM DDR5 5600 16GB 2Gx8 Hynix Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR5 5600 32GB 2Gx8 Samsung(-40~95) Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
SODIMM DDR4 3200 32GB 2Gx8 (-20-85) SAM-C Original IC chip adopted. 30u” Golden Finger. Extended Temperature: -20C~85C. Monitor DRAM software tool support. Lifetime Warranty.
SODIMM DDR4 320016GB 1024x8 (-20-85) SAM-G Original IC chip adopted. 30u” Golden Finger. Extended Temperature: -20C~85C. Monitor DRAM software tool support. Lifetime Warranty.
RDIMM D4 3200 8GB (0-85) Hynix 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
SODIMM DDR4 3200 8GB 1024x8 (-20-85) SAM-G Original IC chip adopted. 30u” Golden Finger. Extended Temperature: -20C~85C. Monitor DRAM software tool support. Lifetime Warranty.
UDIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR5 5600 8GB 1Gx16 (0-95) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR5 4800 8GB 1Gx16 (0-95) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR5 5600 48GB 3Gx8 Micron Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
RDIMM D4 3200 32GB (0-85) Hynix 2Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
RDIMM D4 3200 16GB (0-85) Hynix 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
SODIMM DDR4 3200 Semi 16GB 1Gx8 (0-85) SAM Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
UDIMM DDR5 4800 32GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
ECC UDIMM DDR5 4800 32GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800 MT/s. Capacity :16GB/32GB. Original Samsung IC adopted. ECC function support. Independent Power Management IC build-in. Operation Temperature: 0°C ~ 85°C.
SODIMM DDR5 4800 8GB 1Gx16 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
SODIMM DDR5 4800 32GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.
ECC SODIMM DDR5 4800 16GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity :16GB/32GB. Original Samsung/Micron IC adopted. ECC function support. Independent Power Management IC build-in. Operation Temperature: 0°C ~ 95°C.
SODIMM DDR5 4800 8GB 1Gx16 (-40-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
SODIMM DDR5 4800 16GB 2Gx8 (-40-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.
RDIMM DDR5 4800 32GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.
RDIMM DDR5 4800 16GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.
260pin SODIMM-D4-2666 16G 1Gbx8 HYNX 0-85 Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
ECC UDIMM DDR4 3200 8GB (0-85) SAM-G Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
SODIMM DDR4 3200 8GB 1Gx8 (-40-85) SAM 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. Fixed BOM & lifetime warranty. DRAM Software Monitoring.
SODIMM DDR4 3200 4GB 512x16 (-40-85) SAM 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. Fixed BOM & lifetime warranty. DRAM Software Monitoring.
ECC UDIMM DDR4 3200 16GB (0-85) SAM-G Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
SODIMM ECC DDR4 3200 16GB 1Gx8 (0-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
SODIMM DDR4 3200 32GB 2Gx8 (-40-85) SAM 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. Fixed BOM & lifetime warranty. DRAM Software Monitoring.
SODIMM DDR4 3200 16GB 1Gx8 (-40-85) SAM 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. Fixed BOM & lifetime warranty. DRAM Software Monitoring.
SODIMM ECC DDR4 3200 16GB 1Gx8 (-40-85) SAM 260pin SODIMM ECC DIMM. Data transfer rate: 2666/3200 MT/s. Capacity: 4/8/16/32GB. Original IC chip (Samsung/Hynix). Wide temperature support -40oC~85oC. ECC function support.
RDIMM D4 3200 8GB (0-85) SAM-G 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
RDIMM D4 3200 16GB (0-85) SAM-G 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
SODIMM DDR4 3200 8GB (0-85) SAM-G Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
RDIMM D4 3200 32GB (0-85) SAM 2Gbx4 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
SODIMM DDR4 3200 8GB 1024x8 (-20-85) SAM-C Original IC chip adopted. 30u” Golden Finger. Extended Temperature: -20C~85C. Monitor DRAM software tool support. Lifetime Warranty.
RDIMM D4 3200 128GB (0-85) SAM 8Gx4 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.
ECC UDIMM DDR4 2666 4GB 512x8 (0-85) Fixed BOM/ Fixed die. 30u” golden finger. Tier one original chip adopted. EEPROM with Thermal sensor. 100% Screen Test. Burn-In Test.
