UDIMM DDR4 3200 8GB 1024x8 (0-85) Micron 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16/32GB. Operating Temperature: 0°C ~ 85°C. Fixed BOM / Lifetime warranty.

SQF Half-Size mSATA 650 64G 3D sTLC (-40~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support Write Protection by customized. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2280 SSD 650 1T 3D BiCS8 (-25~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

ECC UDIMM DDR4 3200 16GB 1Gx8 (0-85) Micron 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty. ECC function support. 30μ" PCB Golden Finger.

SQF M.2 2280 740-F 2T 3D TLC BiCS8 (-25~ PCIe/NVMe Gen5 x4 SSD. NGFF M.2 2280 (M Key). Compliant with PCIe Gen5 x4 interface and NVMe 2.0. Support LDPC with RAID ECC algorithm. GPIO preserved for security function control. Advanced Device Security, AES-256, OPAL 2.0 support.

SQF M.2 2242 SSD 660 128G 3D BiCS5 (-20~75°C) SATA 3.2 Compliant. Supports LDCP & RAID ECC. SMART, SQLog & SQAnalyzer for diagnosis. GUI management tool & software API package. -20 to +75 °C operation temperature, and can withstand peak up to -40℃ or 85℃ for 1hr.

SQF U.2 SSD EU-2 15360G 3D TLC BiCS5 (0~70°C) U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Compliant with PCIe Gen.5 x 4 interface and NVMe Express 2.0. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Heat-spreading design with thermal solution. SMART and GUI management tool.

SQF M.2 2280 930L 480G 3D TLC BiCS5 (-20~85°C) Compliant with PCIe Gen.4 x4 interface and NVMe 1.4. 5Y DWPD >1 High Endurance. Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. SMART and GUI management tool.

SQF M.2 2280 720-D 32G 3D sTLC BiCS5 (-40~85°C) NGFF M.2 2280 SSD (B & M key). Compliant with PCIe Gen. III x2 interface and NVMe 1.3. Support LDPC with RAID ECC. TRIM supported. GUI management tool & software API package.

SQF 2.5" SSD 650 4T 3D BiCS8 (-25~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2242 SSD 660 1T 3D BiCS5 (-20~75°C) SATA 3.2 Compliant. Supports LDCP & RAID ECC. SMART, SQLog & SQAnalyzer for diagnosis. GUI management tool & software API package. -20 to +75 °C operation temperature, and can withstand peak up to -40℃ or 85℃ for 1hr.

SQF U.2 SSD EU-2 3840G 3D TLC BiCS5 (0~70°C) U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Compliant with PCIe Gen.5 x 4 interface and NVMe Express 2.0. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Heat-spreading design with thermal solution. SMART and GUI management tool.

SQF M.2 2280 SSD 650 4T 3D BiCS8 (-25~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2280 720-D 64G 3D sTLC BiCS5 (-40~85°C) NGFF M.2 2280 SSD (B & M key). Compliant with PCIe Gen. III x2 interface and NVMe 1.3. Support LDPC with RAID ECC. TRIM supported. GUI management tool & software API package.

SQF U.2 SSD EU-2 30720G 3D TLC BiCS5 (0~70°C) U.2 (SFF-8639) PCIe/NVMe 2.5" SSD. Compliant with PCIe Gen.5 x 4 interface and NVMe Express 2.0. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. Heat-spreading design with thermal solution. SMART and GUI management tool.

SQF M.2 2280 930L 1.9T 3D TLC BiCS5 (-20~85°C) Compliant with PCIe Gen.4 x4 interface and NVMe 1.4. 5Y DWPD >1 High Endurance. Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. SMART and GUI management tool.

SQF 2.5" SSD 650 2T 3D BiCS8 (-25~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

UDIMM DDR5 5600 32GB 2Gx8 Hynix Data Transfer Rate: 5600 MT/s. Capacity : 8/16/24/32/48 GB. Original Samsung/Hynix/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.

SQF 2.5" SSD 650 1T 3D BiCS8 (-25~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDPC & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF Half-Size mSATA 650 64G 3D sTLC (-40~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support Write Protection by customized. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2280 730-D 256G 3D TLC BiCS5 (-20~85°C) PCIe/NVMe Gen.4 x4 SSD. NGFF M.2 2280 (M Key). Compliant with PCIe Gen.4 x4 interface and NVMe 1.4. Support LDPC with RAID ECC algorithm. GPIO preserved for security function control. Advanced Device Security, AES-256, OPAL 2.0 support.

UDIMM DDR5 5600 8GB 1Gx16 Hynix Data Transfer Rate: 5600 MT/s. Capacity : 8/16/24/32/48 GB. Original Samsung/Hynix/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.

RDIMM D4 3200 32GB (0-85) Micron 2Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.

SQF M.2 2280 SSD 650 2T 3D BiCS8 (-25~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2280 SSD 650 256G 3D BiCS8 (-25~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2280 SSD 660 512G 3D BiCS5 (-20~75°C) SATA 3.2 Compliant. Supports LDCP & RAID ECC. SMART, SQLog & SQAnalyzer for diagnosis. GUI management tool & software API package. -20 to +75 °C operation temperature, and can withstand peak up to -40℃ or 85℃ for 1hr.

SQF M.2 2280 720-D 128G 3D sTLC BiCS5 (-40~85°C) NGFF M.2 2280 SSD (M key). Compliant with PCIe Gen. III x4 interface and NVMe 1.3. Support LDPC with RAID ECC. TRIM supported. GUI management tool & software API package.

ECC UDIMM DDR5 5600 48GB 3Gb*8 (0-95) Micron Data Transfer Rate: 5600 MT/s. Capacity : 16GB/32GB. Original:Samsung/Micron IC adopted. Independent Power Management IC build-in. ECC function support. Operating Temperature: 0°C ~ 85°C.

RDIMM D4 3200 16GB (0-85) Micron1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.

RDIMM DDR5 5600 128GB 8Gx4 Hynix Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.

UDIMM DDR4 3200 8GB 1Gx8 (0-85C) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16GB/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty.

UDIMM DDR5 5600 16GB 2Gx8 Hynix Data Transfer Rate: 5600 MT/s. Capacity : 8/16/24/32/48 GB. Original Samsung/Hynix/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.

UDIMM DDR4 3200 4GB 512x16 (0-85) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16GB/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty.

UDIMM DDR4 3200 32GB 2Gx8 (0-85C) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16GB/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty.

UDIMM DDR4 3200 16GB 1Gx8 (0-85C) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 4GB/8GB/16GB/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty.

UDIMM ECC DDR4 3200 8GB 1Gx8 (0-85) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty. ECC function support. 30μ" PCB Golden Finger.

UDIMM ECC DDR4 3200 32GB 2Gx8 (0-85) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty. ECC function support. 30μ" PCB Golden Finger.

UDIMM ECC DDR4 3200 16GB 1Gx8 (0-85) Hynix 288-pin Dual In-Line Memory Module. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C. Lifetime warranty. ECC function support. 30μ" PCB Golden Finger.

SODIMM DDR5 5600 32GB 2Gx8 (-40-85) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung/Hynix IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.

SODIMM DDR5 5600 8GB 1Gx16 (-40-85) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung/Hynix IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.

SODIMM DDR5 5600 16GB 2Gx8 (-40-85) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8GB/16GB/32GB. Original Samsung/Hynix IC adopted. Independent Power Management IC build-in. Operating Temperature: -40°C ~ 95°C.

SODIMM D4 3200 8GB (0-85) 1Gx8 Hynix Original Hynix IC chips adopted. Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. Lifetime warranty.

SODIMM DDR4 3200 4GB 512x16 (0-85) Hynix Original Hynix IC chips adopted. Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. Lifetime warranty.

SODIMM D4 3200 32GB (0-85) 2Gx8 Hynix Original Hynix IC chips adopted. Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. Lifetime warranty.

SODIMM ECC DDR4 3200 8GB 1Gx8 (0-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.

SODIMM ECC DDR4 3200 16GB 1Gx8 (0-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.

SODIMM ECC DDR4 3200 32GB 2Gx8 (0-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.

SODIMM DDR4 3200 8GB 1Gx8 (-40-85) Micron 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.

SODIMM DDR4 3200 8GB (-40-85)Hynix 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.

SODIMM ECC DDR4 3200 8GB 1Gx8 (-40-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.

SODIMM DDR4 3200 32GB 2Gx8 (-40-85) Micron 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.

SODIMM DDR4 3200 4GB 512x16 (-40-85) Hynix 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.

SODIMM DDR4 3200 16GB 1Gx8 (-40-85) Micron 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.

SODIMM ECC DDR4 3200 32GB 2Gx8 (-40-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.

SODIMM ECC DDR4 3200 16GB 1Gx8 (-40-85) Hynix 260pin SODIMM ECC DIMM. Data Transfer Rate: 3200 MT/s. Capacity: 8/16/32GB. Operating Temperature: 0°C ~ 85°C/-40°C ~ 85°C. ECC function support.

SODIMM DDR4 3200 16GB (-40-85)Hynix 30u” Golden Finger. Wide Temp range: -40oC~85oC. Tier one original chip adopt. lifetime warranty. DRAM Software Monitoring.

RDIMM DDR5 5600 32GB 2Gx8 Samsung Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.

RDIMM DDR5 5600 32GB 2Gx8 Hynix Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.

RDIMM DDR5 5600 16GB 2Gx8 Samsung Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.

RDIMM DDR5 5600 16GB 2Gx8 Hynix Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.

SQF 2.5" SSD 840L 7680G 3D TLC BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. 5Y DWPD >1 High Endurance. Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. GUI management tool & software API package.

SODIMM DDR4 3200 32GB 2Gx8 (-20-85) SAM-C Original IC chip adopted. 30u” Golden Finger. Extended Temperature: -20C~85C. Monitor DRAM software tool support. Lifetime Warranty.

SODIMM DDR4 320016GB 1024x8 (-20-85) SAM-G Original IC chip adopted. 30u” Golden Finger. Extended Temperature: -20C~85C. Monitor DRAM software tool support. Lifetime Warranty.

RDIMM D4 3200 8GB (0-85) Hynix 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.

SODIMM DDR4 3200 8GB 1024x8 (-20-85) SAM-G Original IC chip adopted. 30u” Golden Finger. Extended Temperature: -20C~85C. Monitor DRAM software tool support. Lifetime Warranty.

SQF Half-Size mSATA 650 256G 3D TLC (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support Write Protection by customized. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF 2.5" SSD 840V-D 1920G 3D BiCS5 (-40~85°C) Compliant with SATA III and SATA v3.2 standard. Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support HW Write Protection. Support LDPC with RAID ECC. GUI management tool & software API package.

SQF 2.5" SSD 840L 3840G 3D TLC BiCS5 (0~70°C) Compliant with SATA III and SATA v3.2 standard. 5Y DWPD >1 High Endurance. Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. GUI management tool & software API package.

SQF M.2 2242 720-D 128G 3D sTLC BiCS5 (-40~85°C) NGFF M.2 2242 SSD (M key). Compliant with PCIe Gen. III x4 interface and NVMe 1.3. Support LDPC with RAID ECC. TRIM supported. GUI management tool & software API package.

SQF M.2 2280 720-D 64G 3D sTLC BiCS5 (0~70°C) NGFF M.2 2280 SSD (M key). Compliant with PCIe Gen. III x4 interface and NVMe 1.3. Support LDPC with RAID ECC. TRIM supported. GUI management tool & software API package.

SQF Half-Size mSATA 650 128G 3D sTLC (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support Write Protection by customized. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF Half-Size mSATA 650 32G 3D sTLC (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support Write Protection by customized. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SODIMM DDR5 4800 8GB 1Gx16 (0-95) Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.

SODIMM DDR5 5600 48GB 3Gx8 Micron Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.

RDIMM DDR5 5600 64GB 4Gx4 Hynix Data Transfer Rate: 4800/5600 MT/s. Capacity : 16/32/64/128GB. 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger. Operating Temperature: 0°C ~ 95°C.

RDIMM D4 3200 32GB (0-85) Hynix 2Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.

RDIMM D4 3200 16GB (0-85) Hynix 1Gbx8 100% Screening Test. Compatible with server platform. Original IC chip adopted. 30u” golden finger.

SQF M.2 2242 SSD 650 256G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2242 SSD 650 128G 3D sTLC BiCS5(-40~85°C SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2242 SSD 650 64G 3D sTLC BiCS5(-40~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2242 SSD 650 64G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2242 SSD 650 32G 3D sTLC BiCS5(-40~85°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF M.2 2242 SSD 650 32G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. AES-256 Support & TCG-OPAL Compliant. Support FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF mSATA SSD 650 512G 3D sTLC BiCS5 (-40~85°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF mSATA 650 256G 3D sTLC BiCS5 (-40~85°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF mSATA 650 64G 3D sTLC BiCS5 (-40~85°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF mSATA SSD 650 64G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF mSATA 650 32G 3D sTLC BiCS5 (-40~85°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF mSATA SSD 650 32G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF mSATA 650 128G 3D sTLC BiCS5 (-40~85°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF mSATA SSD 650 128G 3D sTLC BiCS5 (0~70°C) SATA 3.2 Compliant. MO-300 mSATA Module. AES-256 Support & TCG-OPAL Compliant. Support HW and FW Write Protection. Supports LDCP & RAID ECC. GUI management tool & software API package. Multiple Temperature Range Product Selection. High Endurance sTLC Product Selection.

SQF SLIM SSD 640 64G MLC (-40~85°C) MO-297 Half-Slim SATA Module. Compliant with SATA III and SATA v 3.2 standard. Supports LDPC & RAID ECC. Supports Fragment Writing Technology and Flush Manager. Shock resistance, anti-vibration and low power consumption. GUI management tool & software API package.

SQF E1.S 930L 3.8T 3D TLC BiCS5 (0~70°C) Compliant with PCIe Gen.4 x4 interface and NVMe 1.4. 5Y DWPD >1 High Endurance. Added Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. SMART and GUI management tool.

SQF E1.S 930L 1.9T 3D TLC BiCS5 (0~70°C) Compliant with PCIe Gen.4 x4 interface and NVMe 1.4. 5Y DWPD >1 High Endurance. Added Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. SMART and GUI management tool.

SQF E1.S 930L 960G 3D TLC BiCS5 (0~70°C) Compliant with PCIe Gen.4 x4 interface and NVMe 1.4. 5Y DWPD >1 High Endurance. Added Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. SMART and GUI management tool.

SQF E1.S 930L 480G 3D TLC BiCS5 (0~70°C) Compliant with PCIe Gen.4 x4 interface and NVMe 1.4. 5Y DWPD >1 High Endurance. Added Power Loss Protection. AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC. SMART and GUI management tool.

SODIMM DDR4 3200 Semi 16GB 1Gx8 (0-85) SAM Original Samsung/Micron IC chips adapted. Data transfer rate: 3200/2666MT/s. Capacity: 2/4/8/16/32GB. Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.

UDIMM DDR5 4800 32GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.

ECC UDIMM DDR5 4800 32GB 2Gx8 (0-85) Samsung Data Transfer Rate: 4800 MT/s. Capacity :16GB/32GB. Original Samsung IC adopted. ECC function support. Independent Power Management IC build-in. Operation Temperature: 0°C ~ 85°C.

SODIMM DDR5 4800 8GB 1Gx16 (0-85) Samsung Data Transfer Rate: 4800/5600 MT/s. Capacity : 8/16/24/32/48GB. Original Samsung/Micron IC adopted. On-Die ECC function support. Independent Power Management IC build-in. Operating Temperature: 0°C ~ 95°C.