Subcategories
INTEL NIC 10/1GbE PCIEx8 2pt SFP+ LowPro 1G/10G. Dual Ports. PCI Express (PCIe) 3.0, x8. Supports 10GBASE-SR, 10GBASE-LR and SFP+ Direct Attach Copper (DAC) physical media. Network Virtualization offloads including Geneve, VXLAN and NVGRE. Intelligent offloads to enable high performance with Intel Xeon servers. Unified networking providing a single wire...
- On enquiry
8G ECC SO-DDR4-2666 1GX8 1.2V SAM DDR4 2666Mhz SO-DIMM / UDIMM with ECC. 30μ" gold plating thickness. Anti-sulfuration resistor. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.
- On enquiry
8G ECC DDR4-2666 1GX8 1.2V SAM DDR4 2666Mhz SO-DIMM / UDIMM with ECC. 30μ" gold plating thickness. Anti-sulfuration resistor. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.
- On enquiry
HLDS Ultra Slim DVR 8X SATA Blu-Ray Bla 9.5mm height internal ultra slim BD/DVD writer drive. Correspond to Serial ATA bus interface. Large buffer memory 4MB. M-Disc DVD and BD Write/Read Support (Studies conducted by U.S Naval Air Warfare Center Weapons Division). Supports BDXL (100GB Triple Layer) Disc.
- On enquiry
Toshiba 3.5" SATA3 1TB 7200 128MB Large-Capacity (up to 14TB) in an industry standard 3.5-inch Form-Factor. Designed for 24 × 7 workloads of up to 550 total TB Transferred per Year. 512 Native Sector Technology. The latest Vibration Technology. Sanitize Instant Erase (SIE) Option Available.
- On enquiry
(DEL22)16G ECC DDR4-2400 1GX8 1.2V SAM DDR4 2400 ECC DIMM. 30μ" gold plating thickness (IPC-2221 standard). 1.2V power consumption. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.
- On enquiry
16G ECC DDR4-2666 1GX8 1.2V SAM DDR4 2666Mhz SO-DIMM / UDIMM with ECC. 30μ" gold plating thickness. Anti-sulfuration resistor. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.
- On enquiry
16G ECC SO-DDR4-2400 1GX8 1.2V HYX DDR4 2400 ECC SO DIMM. 30μ" gold plating thickness (IPC-2221 Standard). 1.2V Power Consumption. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Hynix Original Chip.
- On enquiry
(DEL22)16G ECC SO-DDR4-2400 1GX8 1.2V SA DDR4 2400 ECC SO-DIMM. 30μ" gold plating thickness (IPC-2221 standard). 1.2V power consumption. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.
- On enquiry
16G ECC SO-DDR4-2666 1GX8 1.2V SAM DDR4 2666Mhz SO-DIMM / UDIMM with ECC. 30μ" gold plating thickness. Anti-sulfuration resistor. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.
- On enquiry