Micron 8G DDR4 3200 288PIN 1GbX8 REG 1.2V DDR4-3200 Registered ECC DIMM. 1.2V power consumption. Supports ECC error detection and correction. Data bus inversion (DBI) for data bus. Low-power auto self refresh (LPASR).

Micron 64G DDR4 3200 288PIN 16Gbx4 REG Micron DRAM Chip. DDR4. Registered DIMM. Gold edge contacts. 64GB.

Micron 32G DDR4 3200 288PIN 2GX4 REG 1.2V DDR4-3200 Registered ECC DIMM. 1.2V power consumption. Supports ECC error detection and correction. Data bus inversion (DBI) for data bus. Low-power auto self refresh (LPASR).

Micron 16G DDR4 3200 288PIN 2GbX8 REG 1.2V DDR4-3200 Registered ECC DIMM. 1.2V power consumption. Supports ECC error detection and correction. Data bus inversion (DBI) for data bus. Low-power auto self refresh (LPASR).

15.6" Mildex CTP STANDARD, GG w/EETI-80H Edge-to-edge design. Configured touch panel module. Customized cover glass design. Enhance material with for outdoor solution (optional). High signal and noisy ratio (S/NR) IC solutions. Support 10 fingers touch function.

12.1" Mildex CTP STANDARD, GFF w/EETI-80 Edge-to-edge design. Configured touch panel module. Customized cover glass design. Enhance material with for outdoor solution (optional). High signal and noisy ratio (S/NR) IC solutions. Support 10 fingers touch function.

XEON 2.3G 36M 3647P 24C Gold 6252N Intel Xeon Silver 6252N. 2.3 GHz. 36 MB Cache. FCLGA3647.

Mircon Crucial MX500 TLC SSD SATA3 2.5" 500G Micron Original Chip with 5-year limited warranty. S.M.A.R.T., TRIM and NCQ support to maintain a healthy, efficient SSD.. Built-in wear-leveling algorithm ensures highly reliable of data transfer.. Storage up to 4TB of data.

SG Enterprise 3.5"4TB 7KRPM SATA 256MB 3.5" SATA Interface. 7200 RPM spindle speed.. High instantaneous (burst) data-transfer rates (up to 600MB per second). State-of-the-art cache and on-the-fly error-correction algorithms. Support for S.M.A.R.T. drive monitoring and reporting.

Micron 8GB DDR4 UDIMM 3200Mhz 1Gbx8 1.2V DDR4 3200Mhz Unbuffered DIMM. 1.2V Power Consumption. Low-power auto self- refresh (LPASR). Data bus inversion (DBI) for data bus. Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals.

8G ECC SO-DDR4-2666 1GX8 1.2V SAM DDR4 2666Mhz SO-DIMM / UDIMM with ECC. 30μ" gold plating thickness. Anti-sulfuration resistor. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.

8G SO-DDR3-1600 512X8 1.35V SAM -40~85℃ 30u" Gold Plating Thickness. Anti-sulfurization resistance. Samsung original chip. Wide Temp. -40C to +85C. 100% tested for stability, compatibility and performance.

8G SO-DDR3-1600 512X8 1.35V HYX DDR3-1600 SO-DIMM. 204-Pin. 512MX8. Hynix Chip.

8G ECC SO-DDR3-1600 512X8 1.35V&1.5V SAM DDR3-1600 ECC SO-DIMM. 204-Pin. 512MX8. Samsung Chip.

8G ECC-DDR4-3200 1.2V 1GX8 SAM 8GB. Speed 3200MHz. 30u" Gold Plating Thickness. Anti-sulfurization resistance. ECC.

8G ECC DDR4-2666 1GX8 1.2V SAM DDR4 2666Mhz SO-DIMM / UDIMM with ECC. 30μ" gold plating thickness. Anti-sulfuration resistor. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.

8G R-DDR3-1600 1.35V&1.5V 512X8 SAM DDR3-1600 ECC Registered. 240-Pin. 512MX8. Samsung Chip.

8G DDR3-1600 512X8 1.35V HYX DDR3-1600. 240-Pin. 512MX8. Hynix Chip.

8GB ECC-DDR3-1600 1.35V&1.5V 512X8 SAM DDR3-1600 ECC. 240-Pin. 512MX8. Samsung Chip.

HLDS Ultra Slim DVR 8X SATA Blu-Ray Black 9.5mm height internal ultra slim BD/DVD writer drive. Correspond to Serial ATA bus interface. Large buffer memory 4MB. M-Disc DVD and BD Write/Read Support (Studies conducted by U.S Naval Air Warfare Center Weapons Division). Supports BDXL (100GB Triple Layer) Disc.

1GB I-GRADE SO-DDR1 400MHz 64Mx8 Micron DDR1-400 SO-DIMM. 200-Pin. 64MX8. Micron Chip.

1G SO-DDR1 400 64X8 PROMOS DDR1-400. 200-Pin. 64MBX8. Promos Chip.

CREMAX M-RACK SATA 5.25"X2 TO 3HDD BLACK Fits 3 x 3.5"/ 2.5" SATA SSD/HDD in two 5.25" drive bay. Metal body w/ partial plastic. Auto-eject pul in/out handle. Support up to SATA 6Gb/s and hot swap.

CREMAX M-RACK 5.25" 4X2.5" SAS/ST BLK(G) Output：5.25". Input：4* 2.5" HDD/SSD. Lenth：2* 4cm Fan. PCIE Bracket：Black. Compatible Devices：Green: Device Power. Amber: Drive Activity.

WD IPC 2.5 2TB 5KRPM 7MM SATAIII 128MB 2TB Capacity. Recommended for certain industrial applications. 7.5" 7mm height. 8X5 Application.

SG AV 2.5" 2TB SATAIII 5K 128MB Workload rates of up to 180 TB per year. Reliable performance in write-intensive monitoring systems. 24X7 Application.

(DEL22)PENTIUM 3.2G 3M 1150P G3420 Intel Pentium G3420. 3.2 GHz. 3 MB Cache. LGA1150.

WD AV 3TB 3.5" 5KRPM SATAIII 64MB 4K 3TB Storage. Designed for 24x7 reliability. 5K RPM 64MB Cache. Ideal for NVR / DVR / PVR / IPTV. SATA Interface. 3 year limited warranty.

WD Enterprise 3.5" 1 TB 7RPM SATAIII 128MB 1TB Storage. Designed for 24x7 reliability. 7K RPM 128MB Cache. RAID Supported & 24X7. SATA Interface. 5 year limited warranty.

Toshiba 3.5" SATA3 1TB 7200 128MB Large-Capacity (up to 14TB) in an industry standard 3.5-inch Form-Factor. Designed for 24 × 7 workloads of up to 550 total TB Transferred per Year. 512 Native Sector Technology. The latest Vibration Technology. Sanitize Instant Erase (SIE) Option Available.

ATP 8G MICRO SD CARD I-GRD SLC(G) Supports SD mode, SPI mode. High reliability, operating at -40~ 85°C. SLC NAND flash memory. Water proof, Dust proof and ESD resistant. Enhanced power cycling support.

SSSTC SEMI-WT SSD 512GB 2280 SATA3 Tos KIOXIA 3D TLC. SATAIII. DEVICE-ON SUPPORT. SEMI-WI SUPPORT (-25℃ ~ 85℃). UP TO 550MB PERFORMANCE. OPTIMIZED FOR IPC, AND EDGE STORAGE.

SSSTC SEMI-WT SSD 512GB 2.5" SATA3 Tos KIOXIA 3D TLC. SATAIII. DEVICE-ON SUPPORT. SEMI-WI SUPPORT (-25℃ ~ 85℃). UP TO 550MB PERFORMANCE. OPTIMIZED FOR IPC, AND EDGE STORAGE.

4G DDR4 2400 512x8 REG VLP -40~85C SAM DDR4-2400 Registered DIMM. Very Low Profile. Wide temperature. 30μ" gold plating thickness. 1.2V Power Consumption. Provides better reliability, availability and serviceability (RAS) and improves data integrity.

Micron 16GB DDR4 UDIMM 3200Mhz 2Gbx8 1.2 DDR4 3200Mhz Unbuffered DIMM. 1.2V Power Consumption. Low-power auto self- refresh (LPASR). Data bus inversion (DBI) for data bus. Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals.

CORE 2.4G 4M 1150P 2CORE I3-4330TE Intel 4th Generation i3-4330TE. 2.4 GHz. 4 MB Cache. LGA1150.

CORE 2.6G 4M 1150P 2CORE I3-4340TE Intel 4th Generation i3-4340TE. 2.6 GHz. 4 MB Cache. LGA1150.

CORE 3.1G 4M 1150P 2CORE I3-4350T Intel 4th Generation i3-4350T. 3.1 GHz. 4 MB Cache. LGA1150.

CORE 3.5G 4M 1150P 2CORE I3-4330 Intel 4th Generation i3-4330. 3.5 GHz. 4 MB Cache. LGA1150.

CORE 3.7G 4M 1150P 2CORE I3-4360 Intel 4th Generation i3-4360. 3.7 GHz. 4 MB Cache. LGA1150.

CORE 3.1G 6M 1151P 4CORE I3-8100T Intel Core i3-8100T. 3.1 GHz. 6 MB Cache. FCLGA1151.

CORE I3 2.3G 6M 1200P 4C I3-10100TE Intel Core i3-10100TE. 2.3 GHz. 6 MB Cache. FCLGA1200.

CORE I3 3.2G 6M 1200P 4C I3-10100E Intel Core i3-10100E. 3.2 GHz. 6 MB Cache. FCLGA1200.

CORE 2.2G 6M 1151P 4C I3-9100TE Intel Core i3-9100TE. 2.2 GHz. 6 MB Cache. FCLGA1151.

CORE 3.4G 3M 1151P 2CORE I3-7101TE Intel Core i3-7101TE. 3.4 GHz. 3 MB Cache. LGA1151.

CORE 3.9G 3M 1151P 2CORE I3-7101E Intel Core i3-7101E. 3.9 GHz. 3 MB Cache. LGA1151.

CORE 2.7G 4M 1151P 2 CORE I3-6100TE Intel 6th Generation Core i3-6100TE. 2.7 GHz. 4 MB Cache. LGA1151.

CORE 3.7G 3M 1151P 2 CORE I3-6100 Intel 6th Generation Core i3-6100. 3.7 GHz. 3 MB Cache. LGA1151.

CORE 2.0G 6M 1150P 4CORE I5-4590T Intel 4th Generation Core i5-4590T. Up to 3.0 GHz. 6 MB Cache. LGA1150.

CORE 2.7G 4M 1150P 2 CORE I5-4570TE Intel 4th Generation Core i5-4570TE. Up to 3.3 GHz. 4 MB Cache. LGA1155.

CORE 2.9G 6M 1150P 4 CORE I5-4570S Intel 4th Generation Core i5-4570S. Up to 3.6 GHz. 6 MB Cache. LGA1150.

CORE 3.0G 6M 1150P 4CORE i5-4590S Intel 4th Generation Core i5-4590S. Up to 3.7 GHz. 6 MB Cache. LGA1150.

CORE 2.1G 9M 1151P 6CORE i5-8500T Intel Core i5-8500T. 2.1 GHz. 9 MB Cache. FCLGA1151.

CORE 2.7G 6M 1151P 4CORE I5-7500T Intel 7th Generation Core i5-7500T. 2.7 GHz. 6 MB Cache. LGA1151.

CORE 3.4G 6M 1151P 4CORE I5-7500 Intel 7th Generation Core i5-7500. 3.4 GHz. 6 MB Cache. LGA1151.

CORE 2.3G 6M 1151P 4 CORE I5-6500TE Intel 6th Generation Core i5-6500TE. Up to 3.3 GHz. 6 MB Cache. LGA1151.

CORE 3.2G 6M 1151P 4 CORE I5-6500 Intel 6th Generation Core i5-6500. Up to 3.6 GHz. 6 MB Cache. LGA1151.

(DEL18)CORE 3.4G 8M 1155P 4CORE I7-2600 Intel 2nd Generation Core i7-2600. Up to 3.8 GHz. 8 MB Cache. LGA1155.

Xeon 3.2G 8M 1150P 4CORE E3-1225 v3 Intel Xeon E3-1225 v3. 3.2 GHz. 8 MB Cache. LGA1150.

XEON 2.4G 12M 1200P 6C W-1250TE Intel Xeon W-1250TE. 2.4 GHz. 12 MB Cache. FCLGA1200.

XEON 3.5G 12M 1200P 6C W-1250E Intel Xeon W-1250E. 3.5 GHz. 12 MB Cache. FCLGA1200.

XEON 3.4G 12M 1151P 6C E-2226GE Intel Xeon E-2226GE. 3.4 GHz. 12 MB Cache. FCLGA1151.

XEON 3.3G 8M 1151P 4 CORE E3-1225V5 Intel Xeon E3-1225 v5. 3.3 GHz. 8 MB Cache. LGA1151.

15.0" Mildex CTP STANDARD, GFF w/EETI-8 Edge-to-edge design. Configured touch panel module. Customized cover glass design. Enhance material with for outdoor solution (optional). High signal and noisy ratio (S/NR) IC solutions. Support 10 fingers touch function.

18.5" Mildex CTP STANDARD, GFF w/EETI-8 Edge-to-edge design. Configured touch panel module. Customized cover glass design. Enhance material with for outdoor solution (optional). High signal and noisy ratio (S/NR) IC solutions. Support 10 fingers touch function.

21.6" Mildex CTP STANDARD, GG w/EETI-80H84 COF Edge-to-edge design. Configured touch panel module. Customized cover glass design. Enhance material with for outdoor solution (optional). High signal and noisy ratio (S/NR) IC solutions. Support 10 fingers touch function.

(DEL21)Micron 16G DDR4 2933 288PIN 2GbX4 DDR4 2933Mhz Registered DIMM. Supports ECC error detection and correction. 1.2V Power Consumption. Low-power auto self- refresh (LPASR). Provides better reliability, availability and serviceability (RAS) and improves data integrity.

(DEL21)Micron 32G DDR4 2933 288PIN 2GX4 DDR4 2933Mhz Registered DIMM. Supports ECC error detection and correction. 1.2V Power Consumption. Low-power auto self- refresh (LPASR). Provides better reliability, availability and serviceability (RAS) and improves data integrity.

16G ECC DDR4-2400 1GX8 1.2V HYX DDR4-2400 ECC DIMM. 30μ" gold plating thickness (IPC-2221 standard). 1.2V power consumption. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance.

(DEL22)16G ECC DDR4-2400 1GX8 1.2V SAM DDR4 2400 ECC DIMM. 30μ" gold plating thickness (IPC-2221 standard). 1.2V power consumption. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.

16G ECC DDR4-2666 1GX8 1.2V SAM DDR4 2666Mhz SO-DIMM / UDIMM with ECC. 30μ" gold plating thickness. Anti-sulfuration resistor. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.

16G ECC-DDR4-3200 1.2V 1GbX8 SAM 16GB. Speed 3200MHz. 30u" Gold Plating Thickness. Anti-sulfurization resistance. ECC.

16G DDR4-2400 1GX8 1.2V HYX DDR4-2400 Unbuffered DIMM. 30μ" gold plating thickness (IPC-2221 Standard). 1.2V Power Consumption. RoHS compliant. Hynix Original Chip.

16G DDR4-2666 1GbX8 1.2V SAM DDR4 2666Mhz Unbuffered UDIMM. 30μ" gold plating thickness. 1.2V power consumption. 100% tested for stability, compatibility and performance. Samsung original chip.

32G DDR4-2666 2GbX8 1.2V HYX Increased Bandwidth, up to 2600 Mbps. Industrial Stand 30u Gold Plating. Enhanced Power Efficiency. RoHS compliant & Complies with JEDEC standards. Up to 32GB.

32G DDR4-2666 2GbX8 1.2V SAM Increased Bandwidth, up to 2600 Mbps. Industrial Stand 30u Gold Plating. Enhanced Power Efficiency. RoHS compliant & Complies with JEDEC standards. Up to 32GB .

16G ECC SO-DDR4-2400 1GX8 1.2V HYX DDR4 2400 ECC SO DIMM. 30μ" gold plating thickness (IPC-2221 Standard). 1.2V Power Consumption. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Hynix Original Chip.

(DEL22)16G ECC SO-DDR4-2400 1GX8 1.2V SA DDR4 2400 ECC SO-DIMM. 30μ" gold plating thickness (IPC-2221 standard). 1.2V power consumption. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.

16G ECC SO-DDR4-2666 1GX8 1.2V SAM DDR4 2666Mhz SO-DIMM / UDIMM with ECC. 30μ" gold plating thickness. Anti-sulfuration resistor. Serial presence detect with EEPROM. Support ECC error detection and correction. 100% tested for stability, compatibility and performance. Samsung original chip.

16G ECC-SODDR4-3200 1.2V 1GbX8 SAM 16GB. Speed 3200MHz. 30u" Gold Plating Thickness. Anti-sulfurization resistance. ECC.

16G SO-DDR4-2400 1GX8 1.2V HYX DDR4-2400 Unbuffered SO-DIMM. 30μ" gold plating thickness (IPC-2221 Standard). 1.2V Power Consumption. RoHS compliant. Hynix Original Chip.

16G SO-DDR4-2666 1GbX8 1.2V SAM DDR4 2666Mhz Unbuffered SO-DIMM. 30μ" gold plating thickness. 1.2V power consumption. 100% tested for stability, compatibility and performance. Samsung original chip.

32G SO-DDR4-2666 2GbX8 1.2V HYX Increased Bandwidth, up to 2600 Mbps. Industrial Stand 30u Gold Plating. Enhanced Power Efficiency. RoHS compliant & Complies with JEDEC standards. Up to 32GB .

32G SO-DDR4-2666 2GbX8 1.2V SAM Increased Bandwidth, up to 2600 Mbps. Industrial Stand 30u Gold Plating. Enhanced Power Efficiency. RoHS compliant & Complies with JEDEC standards. Up to 32GB .

(DEL23)GT730 2G PCIEX16 DVI+HDMI+VGA Low Prof. NVIDIA GeForce®GT730 GPU. DVI-D, HDMI, and VGA. 2GB Memory size. Low Profile.

SG IPC 5TB 2.5" 5KRPM SATA3 128MB 5 TB Storage. 5K RPM 128MB Cache. Ideal for General Storage purpose. SATA Interface. 3 years warranty.

SG Enterprise 2.5" 1.2TB 10KRPM SAS 12Gb/s 1.2TB Storage. 10K RPM 256MB Cache. RAID Supported & 24X7. SAS 12Gb/s Interface. 5 year limited warranty.

SG Enterprise 2.5" 1TB 7KRPM SATA 128MB 1TB Storage. 7K RPM 128MB Cache. Raid Supported & 24X7. SATA Interface. 5 year limited warranty.

SG Ent 2.5" 2TB 7KRPM SATA 128MB 512E 2TB Storage. 7K RPM 128MB Cache. Raid Supported & 24X7. SATA Interface. 5 year limited warranty.

SG Enterprise 2.5" 600GB 10KRPM SAS 12Gb/s 256MB 600GB Storage. 10K RPM 256MB Cache. RAID Supported & 24X7. SAS 12Gb/s Interface. 5 year limited warranty.

RAIDON SATA3 RAID0/1 2.5"HDDX2 BLK Fits 2 x 2.5" SATA SSD/HDD in one 5.25" drive bay. Support RAID 0/1. Readable LCD display and LED indicators. Support up to SATA 6Gb/s. Support hot swap and auto-rebuild.

ADAPTEC 8405E SAS 4P 12GB/S 512M PCIEX8 RAID 0, 1, 10. 4 Ports (4 internal). 12Gbps compatibility with SA/SATA HDD or SSD devices. Mixed mode RAID adapter and caching HBA functionality.

SOFTWARE, WIN 10 PRO 64BIT ENG 1PK CD INTL. Enterprise-quality security for small and medium business . Fast boot times and responsiveness. Simple to setup and manage. Ability to join Azure Active Directory, with single sign-on to cloud-hosted apps3. Includes Product Key and DVD.

TR 128GB 2.5" SSD SATAIII MLC -40~90°C 2.5". MLC. SATA III. 128GB.

SSSTC SEMI-WT SSD 1TB 2.5" SATA3 Tos 96 KIOXIA 3D TLC. SATAIII. DEVICE-ON SUPPORT. SEMI-WI SUPPORT (-25℃ ~ 85℃). UP TO 550MB PERFORMANCE. OPTIMIZED FOR IPC, AND EDGE STORAGE.

TR 256GB 2.5" SSD SATAIII MLC -10~80°C 2.5". MLC. SATA III. 256GB.

INTEL CELERON 2.2G 2MB 1150P G1820TE Intel Celeron G1820TE. 2.2 GHz. 2 MB Cache. LGA1150.

INTEL CELERON 2.7G 2MB 1150P G1820 Intel Celeron G1820. 2.7 GHz. 2 MB Cache. LGA1150.

CELERON 2.9G 2M 1151P G4900T Intel Celeron G4900T. 2.9 GHz. 2 MB Cache. FCLGA1151.

CELERON 3.1G 2M 1151P G4900 Intel Celeron G4900. 3.1 GHz. 2 MB Cache. FCLGA1151.